Part Details for XPC850ZT66BU by NXP Semiconductors
Overview of XPC850ZT66BU by NXP Semiconductors
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Price & Stock for XPC850ZT66BU
| Part # | Distributor | Description | Stock | Price | Buy | |
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Chip1Cloud | IC MPU MPC8XX 66MHZ 256BGA / MPU PowerQUICC MPC8xx Processor RISC 32bit 66MHz 256-Pin BGA | 1670 |
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RFQ |
Part Details for XPC850ZT66BU
XPC850ZT66BU CAD Models
XPC850ZT66BU Part Data Attributes:
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XPC850ZT66BU
NXP Semiconductors
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Datasheet
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XPC850ZT66BU
NXP Semiconductors
RISC PROCESSOR
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| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | NXP SEMICONDUCTORS | |
| Package Description | BGA-256 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.31.00.01 | |
| Factory Lead Time | 4 Weeks | |
| Address Bus Width | 26 | |
| Bit Size | 32 | |
| Boundary Scan | YES | |
| External Data Bus Width | 32 | |
| Format | FIXED POINT | |
| Integrated Cache | YES | |
| JESD-30 Code | S-PBGA-B256 | |
| Length | 23 mm | |
| Low Power Mode | YES | |
| Number of Terminals | 256 | |
| Operating Temperature-Max | 95 °C | |
| Operating Temperature-Min | ||
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Seated Height-Max | 2.35 mm | |
| Speed | 66 MHz | |
| Supply Voltage-Max | 3.465 V | |
| Supply Voltage-Min | 3.135 V | |
| Supply Voltage-Nom | 3.3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | OTHER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 23 mm | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC |