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MSAST105SB7473MFNA01
TAIYO YUDEN
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$0.0034 | Yes | Active | 47 nF | 25 V | 20 % | 0402 | X7R | 20 % | SURFACE MOUNT | Yes | CERAMIC | CERAMIC CAPACITOR | 15% ppm/°C | e3 | 125 °C | -55 °C | 2 | RECTANGULAR PACKAGE | SMT | TR, Paper, 7 Inch | YES | Matte Tin (Sn) - with Nickel (Ni) barrier | WRAPAROUND | 500 µm | 1 mm | 500 µm | TAIYO YUDEN CO LTD | CHIP | compliant | EAR99 | 8532.24.00.20 | |||
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MSAST105SB5223MFNA01
TAIYO YUDEN
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$0.0034 | Yes | Active | 22 nF | 25 V | 20 % | 0402 | X5R | 20 % | SURFACE MOUNT | Yes | CERAMIC | CERAMIC CAPACITOR | 10% ppm/°C | e3 | 85 °C | -25 °C | 2 | RECTANGULAR PACKAGE | SMT | TR, Paper, 7 Inch | YES | Matte Tin (Sn) - with Nickel (Ni) barrier | WRAPAROUND | 500 µm | 1 mm | 500 µm | TAIYO YUDEN CO LTD | CHIP | compliant | EAR99 | 8532.24.00.20 | |||
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MSAST105SB7223MFNA01
TAIYO YUDEN
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$0.0034 | Yes | Active | 22 nF | 25 V | 20 % | 0402 | X7R | 20 % | SURFACE MOUNT | Yes | CERAMIC | CERAMIC CAPACITOR | 15% ppm/°C | e3 | 125 °C | -55 °C | 2 | RECTANGULAR PACKAGE | SMT | TR, Paper, 7 Inch | YES | Matte Tin (Sn) - with Nickel (Ni) barrier | WRAPAROUND | 500 µm | 1 mm | 500 µm | TAIYO YUDEN CO LTD | CHIP | compliant | EAR99 | 8532.24.00.20 | |||
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MSAST105SB5333KFNA01
TAIYO YUDEN
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$0.0034 | Yes | Active | 33 nF | 25 V | 10 % | 0402 | X5R | 10 % | SURFACE MOUNT | Yes | CERAMIC | CERAMIC CAPACITOR | 10% ppm/°C | e3 | 85 °C | -25 °C | 2 | RECTANGULAR PACKAGE | SMT | TR, Paper, 7 Inch | YES | Matte Tin (Sn) - with Nickel (Ni) barrier | WRAPAROUND | 500 µm | 1 mm | 500 µm | TAIYO YUDEN CO LTD | CHIP | compliant | EAR99 | 8532.24.00.20 | |||
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MSAST105SB5153MFNA01
TAIYO YUDEN
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$0.0034 | Yes | Active | 15 nF | 25 V | 20 % | 0402 | X5R | 20 % | SURFACE MOUNT | Yes | CERAMIC | CERAMIC CAPACITOR | 10% ppm/°C | e3 | 85 °C | -25 °C | 2 | RECTANGULAR PACKAGE | SMT | TR, Paper, 7 Inch | YES | Matte Tin (Sn) - with Nickel (Ni) barrier | WRAPAROUND | 500 µm | 1 mm | 500 µm | TAIYO YUDEN CO LTD | CHIP | compliant | EAR99 | 8532.24.00.20 | TAIYO YUDEN | ||
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MSAST105SB5333MFNA01
TAIYO YUDEN
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$0.0034 | Yes | Active | 33 nF | 25 V | 20 % | 0402 | X5R | 20 % | SURFACE MOUNT | Yes | CERAMIC | CERAMIC CAPACITOR | 10% ppm/°C | e3 | 85 °C | -25 °C | 2 | RECTANGULAR PACKAGE | SMT | TR, Paper, 7 Inch | YES | Matte Tin (Sn) - with Nickel (Ni) barrier | WRAPAROUND | 500 µm | 1 mm | 500 µm | TAIYO YUDEN CO LTD | CHIP | compliant | EAR99 | 8532.24.00.20 | |||
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MC0402B104K250CT
SPC Multicomp
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$0.0035 | Yes | Active | 100 nF | 25 V | 10 % | 0402 | X7R | 10 % | SURFACE MOUNT | Yes | CERAMIC | CERAMIC CAPACITOR | 15% ppm/°C | e3 | 125 °C | -55 °C | 2 | RECTANGULAR PACKAGE | SMT | TR, PAPER, 7 INCH | YES | Tin (Sn) - with Nickel (Ni) barrier | WRAPAROUND | 500 µm | 1 mm | 500 µm | MULTICOMP PRO | CHIP | unknown | EAR99 | 8532.24.00.20 | |||
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MC0201N101K160LT
SPC Multicomp
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$0.0035 | Yes | Active | 100 pF | 16 V | 10 % | 0201 | C0G | 10 % | SURFACE MOUNT | Yes | CERAMIC | CERAMIC CAPACITOR | 30ppm/Cel ppm/°C | e3 | 125 °C | -55 °C | 2 | RECTANGULAR PACKAGE | SMT | TAPE | YES | Matte Tin (Sn) - with Nickel (Ni) barrier | WRAPAROUND | 600 µm | 300 µm | MULTICOMP PRO | CHIP | unknown | EAR99 | 8532.24.00.20 | ||||
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MC0402B103J160CT
SPC Multicomp
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$0.0035 | Yes | Active | 10 nF | 16 V | 5 % | 0402 | X7R | 5 % | SURFACE MOUNT | Yes | CERAMIC | CERAMIC CAPACITOR | 15% ppm/°C | e3 | 125 °C | -55 °C | 2 | RECTANGULAR PACKAGE | SMT | TR, PAPER, 7 INCH | YES | Tin (Sn) - with Nickel (Ni) barrier | WRAPAROUND | 500 µm | 1 mm | 500 µm | MULTICOMP PRO | CHIP | unknown | EAR99 | 8532.24.00.20 | |||
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MC0402B221K500CT
SPC Multicomp
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$0.0037 | Yes | Active | 220 pF | 50 V | 10 % | 0402 | X7R | 10 % | SURFACE MOUNT | Yes | CERAMIC | CERAMIC CAPACITOR | 15% ppm/°C | e3 | 125 °C | -55 °C | 2 | RECTANGULAR PACKAGE | SMT | TR, PAPER, 7 INCH | YES | Tin (Sn) - with Nickel (Ni) barrier | WRAPAROUND | 500 µm | 1 mm | 500 µm | MULTICOMP PRO | CHIP | unknown | EAR99 | 8532.24.00.20 |