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MCP47CVB01-E/MG
Microchip Technology Inc
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$0.7880 | Active | 5.5 V | 5.5 V | 0.0391 % | 8 | YES | D/A CONVERTER | BINARY | SERIAL | 1 | 16 µs | 620 µA | AUTOMOTIVE | S-PQCC-N16 | e3 | 125 °C | -40 °C | NOT SPECIFIED | MIL-STD-883 | NOT SPECIFIED | 16 | PLASTIC/EPOXY | HVQCCN | LCC16,.12SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Matte Tin (Sn) | NO LEAD | 500 µm | QUAD | 3 mm | 800 µm | 3 mm | MICROCHIP TECHNOLOGY INC | HVQCCN, | compliant | EAR99 | 8542.39.00.01 | Microchip | ||||||||||||
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MCP47CVB01-E/UN
Microchip Technology Inc
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$0.7880 | Active | 5.5 V | 5.5 V | 0.0391 % | 8 | YES | D/A CONVERTER | BINARY | SERIAL | 1 | 16 µs | 620 µA | AUTOMOTIVE | S-PDSO-G8 | e3 | 125 °C | -40 °C | NOT SPECIFIED | MIL-STD-883 | NOT SPECIFIED | 8 | PLASTIC/EPOXY | TSSOP | TSSOP8,.25 | SQUARE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Matte Tin (Sn) | GULL WING | 500 µm | DUAL | 3 mm | 1.1 mm | 3 mm | MICROCHIP TECHNOLOGY INC | TSSOP, | compliant | EAR99 | 8542.39.00.01 | Microchip | ||||||||||||
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MCP47CVB01-E/MF
Microchip Technology Inc
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$0.7880 | Active | 5 V | 0.0391 % | 8 | YES | D/A CONVERTER | BINARY | SERIAL | 1 | 16 µs | 700 µA | AUTOMOTIVE | S-PDSO-N10 | e3 | 125 °C | -40 °C | NOT SPECIFIED | TS 16949 | NOT SPECIFIED | 10 | PLASTIC/EPOXY | HVSON | SOLCC10,.12,20 | SQUARE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | Matte Tin (Sn) | NO LEAD | 500 µm | DUAL | 3 mm | 1 mm | 3 mm | MICROCHIP TECHNOLOGY INC | HVSON, SOLCC10,.12,20 | compliant | EAR99 | 8542.39.00.01 | Microchip | 2018-09-26 | ||||||||||||
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DS4412U+T&R
Maxim Integrated Products
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$0.7907 | Yes | Yes | Transferred | 5 V | 4.75 V | 6.25 % | 4 | YES | D/A CONVERTER | BINARY | SERIAL | 1 | 500 µA | INDUSTRIAL | S-PDSO-G8 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | 30 | 8 | PLASTIC/EPOXY | TSSOP | TSSOP8,.19 | SQUARE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | MATTE TIN | GULL WING | 650 µm | DUAL | 3 mm | 1.1 mm | 3 mm | MAXIM INTEGRATED PRODUCTS INC | LEAD FREE, MICRO, SOP-8 | compliant | EAR99 | 8542.39.00.01 | SOIC | 8 | |||||||||
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MCP48CVD01-E/UN
Microchip Technology Inc
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$0.7990 | Active | 5.5 V | 0.000390625 % | 8 | YES | D/A CONVERTER | BINARY | SERIAL | 1 | 4 µs | 1.27 mA | S-PDSO-G10 | e3 | 125 °C | -40 °C | 10 | PLASTIC/EPOXY | TSSOP | TSSOP10,.19,20 | SQUARE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Matte Tin (Sn) | GULL WING | 500 µm | DUAL | 3 mm | 1.1 mm | 3 mm | MICROCHIP TECHNOLOGY INC | compliant | 8542.39.00.01 | ||||||||||||||||||||
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MCP48CVD01-E/MF
Microchip Technology Inc
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$0.8043 | Active | 5.5 V | 0.000390625 % | 8 | YES | D/A CONVERTER | BINARY | SERIAL | 1 | 4 µs | 1.27 mA | S-PDSO-N10 | e3 | 125 °C | -40 °C | 10 | PLASTIC/EPOXY | HVSON | SOLCC10,.12,20 | SQUARE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | Matte Tin (Sn) | NO LEAD | 500 µm | DUAL | 3 mm | 1 mm | 3 mm | MICROCHIP TECHNOLOGY INC | compliant | 8542.39.00.01 | ||||||||||||||||||||
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MCP48CVD01-E/MG
Microchip Technology Inc
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$0.8043 | Active | 5.5 V | 0.000390625 % | 8 | YES | D/A CONVERTER | BINARY | SERIAL | 1 | 4 µs | 1.27 mA | S-PQCC-N16 | e3 | 125 °C | -40 °C | 16 | PLASTIC/EPOXY | HVQCCN | LCC16,.12SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Matte Tin (Sn) | NO LEAD | 500 µm | QUAD | 3 mm | 900 µm | 3 mm | MICROCHIP TECHNOLOGY INC | compliant | 8542.39.00.01 | ||||||||||||||||||||
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DAC43401DSGR
Texas Instruments
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$0.8056 | Yes | Yes | Active | 2.7 V | 5.5 V | 0.3906 % | 8 | 22 kHz | YES | D/A CONVERTER | BINARY | SERIAL | 1 | 10 µs | 10 µs | AUTOMOTIVE | S-PDSO-N8 | e4 | 1 | 125 °C | -40 °C | 260 | 30 | 8 | PLASTIC/EPOXY | SON | SQUARE | SMALL OUTLINE | NICKEL PALLADIUM GOLD | NO LEAD | DUAL | TEXAS INSTRUMENTS INC | SON, | compliant | EAR99 | 8542.39.00.01 | Texas Instruments | 2019-07-26 | |||||||||||||
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MCP4726A0T-E/MAY
Microchip Technology Inc
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$0.8141 | Yes | Active | 3 V | 5.46 V | 10 mV | 0.354 % | 12 | YES | D/A CONVERTER | BINARY | SERIAL | 1 | 6 µs | 400 µA | AUTOMOTIVE | S-PDSO-N6 | e4 | 1 | 125 °C | -40 °C | 260 | TS 16949 | 40 | 6 | PLASTIC/EPOXY | HVSON | TSSOP6,.08 | SQUARE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | NICKEL PALLADIUM GOLD | NO LEAD | 650 µm | DUAL | 2 mm | 900 µm | 2 mm | MICROCHIP TECHNOLOGY INC | HVSON, | compliant | EAR99 | 8542.39.00.01 | Microchip | |||||||||
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MCP48FVB11-E/UN
Microchip Technology Inc
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$0.8141 | Yes | Active | 0.0488 % | 10 | YES | D/A CONVERTER | BINARY | SERIAL | 1 | 7.8 µs | 1.7 mA | AUTOMOTIVE | S-PDSO-G10 | e3 | 2 | 125 °C | -40 °C | 260 | TS 16949 | 40 | 10 | PLASTIC/EPOXY | TSSOP | TSSOP10,.19,20 | SQUARE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | MATTE TIN | GULL WING | 500 µm | DUAL | 3 mm | 1.1 mm | 3 mm | MICROCHIP TECHNOLOGY INC | TSSOP, | compliant | EAR99 | 8542.39.00.01 | Microchip |