Parametric results for: 白玉spa哪里好+205913020_Q扣*号 under Flash Memories

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Manufacturer: Spansion
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S29GL128P10TFI010
Spansion
$3.1590 Yes Yes Transferred 134.2177 Mbit 1 128K 128MX1 3 V 100 ns FLASH 8 YES YES YES 1 128 128000000 134.2177 M ASYNCHRONOUS 8/16 words PARALLEL 3 V YES 5 µA 110 µA 3.6 V 2.7 V CMOS INDUSTRIAL YES NOR TYPE R-PDSO-G56 Not Qualified e3 3 85 °C -40 °C 260 40 56 PLASTIC/EPOXY HTSSOP TSSOP56,.8,20 RECTANGULAR SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH YES MATTE TIN GULL WING 500 µm DUAL 1.2 mm 18.4 mm 14 mm SPANSION INC TSOP1 20 X 14 MM, LEAD FREE, MO-142EC, TSOP-56 56 compliant 3A991.B.1.A 8542.32.00.51 Spansion
S29GL512P11TFI010
Spansion
$4.6435 Yes Yes Transferred 536.8709 Mbit 1 128K 512MX1 3 V 110 ns FLASH 8 YES YES YES 1 512 512000000 536.8709 M ASYNCHRONOUS 8/16 words PARALLEL 3 V YES 5 µA 110 µA 3.6 V 2.7 V CMOS INDUSTRIAL YES NOR TYPE R-PDSO-G56 Not Qualified e3 3 85 °C -40 °C 260 40 56 PLASTIC/EPOXY HTSSOP TSSOP56,.8,20 RECTANGULAR SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH YES MATTE TIN GULL WING 500 µm DUAL 1.2 mm 18.4 mm 14 mm SPANSION INC TSOP1 20 X 14 MM, LEAD FREE, MO-142EC, TSOP-56 56 compliant 3A991.B.1.A 8542.32.00.51 Spansion
S29GL256P10TFI010
Spansion
$6.9156 Yes Yes Transferred 268.4355 Mbit 16 128K 16MX16 3 V 100 ns FLASH 8 YES YES YES 1 256 16000000 16.7772 M ASYNCHRONOUS 3-STATE 8/16 words PARALLEL 3 V YES 5 µA 110 µA 3.6 V 2.7 V CMOS INDUSTRIAL YES NOR TYPE R-PDSO-G56 Not Qualified e3 3 85 °C -40 °C 260 40 56 PLASTIC/EPOXY HTSSOP TSSOP56,.8,20 RECTANGULAR SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH YES Matte Tin (Sn) GULL WING 500 µm DUAL 1.2 mm 18.4 mm 14 mm SPANSION INC TSOP1 20 X 14 MM, LEAD FREE, MO-142EC, TSOP-56 56 compliant 3A991.B.1.A 8542.32.00.51 Spansion
S70FL01GSAGBHIC10
Spansion
$9.0300 Transferred 1.0737 Gbit 8 128MX8 3 V 133 MHz FLASH 20 100000 Write/Erase Cycles 1 128000000 134.2177 M SYNCHRONOUS 3-STATE SERIAL 3 V QSPI 200 µA 3.6 V 2.7 V CMOS INDUSTRIAL NOR TYPE HARDWARE/SOFTWARE R-PBGA-B24 85 °C -40 °C 24 PLASTIC/EPOXY TBGA BGA24,5X5,40 RECTANGULAR GRID ARRAY, THIN PROFILE YES BALL 1 mm BOTTOM 1.2 mm 8 mm 6 mm SPANSION INC BGA-24 unknown 3A991.B.1.A 8542.32.00.71
S29GL01GP11TFIR10
Spansion
$9.1523 Yes Yes Transferred 1.0737 Gbit 1 128K 1GX1 3.3 V 110 ns FLASH 8 YES YES YES 1 1K 1000000000 1.0737 G ASYNCHRONOUS 8/16 words PARALLEL 3 V YES 5 µA 110 µA 3.6 V 3 V CMOS INDUSTRIAL YES NOR TYPE R-PDSO-G56 Not Qualified e3 3 85 °C -40 °C 260 40 56 PLASTIC/EPOXY HTSSOP TSSOP56,.8,20 RECTANGULAR SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH YES MATTE TIN GULL WING 500 µm DUAL 1.2 mm 18.4 mm 14 mm SPANSION INC TSOP1 20 X 14 MM, LEAD FREE, MO-142EC, TSOP-56 56 compliant 3A991.B.1.A 8542.32.00.51 Spansion
S29GL01GP12TFI010
Spansion
$22.8786 Yes Yes Transferred 1.0737 Gbit 1 128K 1GX1 3 V 120 ns FLASH 8 YES YES YES 1 1K 1000000000 1.0737 G ASYNCHRONOUS 8/16 words PARALLEL 3 V YES 5 µA 110 µA 3.6 V 2.7 V CMOS INDUSTRIAL YES NOR TYPE R-PDSO-G56 Not Qualified e3 3 85 °C -40 °C 260 40 56 PLASTIC/EPOXY HTSSOP TSSOP56,.8,20 RECTANGULAR SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH YES MATTE TIN GULL WING 500 µm DUAL 1.2 mm 18.4 mm 14 mm SPANSION INC TSOP1 20 X 14 MM, LEAD FREE, MO-142EC, TSOP-56 56 compliant 3A991.B.1.A 8542.32.00.51 Spansion
S29GL01GP11FFIR10
Spansion
$24.2760 Yes Yes Transferred 1.0737 Gbit 1 128K 1GX1 3.3 V 110 ns FLASH 8 YES YES YES 1 1K 1000000000 1.0737 G ASYNCHRONOUS 8/16 words PARALLEL 3 V YES 5 µA 110 µA 3.6 V 3 V CMOS INDUSTRIAL YES NOR TYPE R-PBGA-B64 Not Qualified e1 3 85 °C -40 °C 260 40 64 PLASTIC/EPOXY LBGA BGA64,8X8,40 RECTANGULAR GRID ARRAY, LOW PROFILE YES TIN SILVER COPPER BALL 1 mm BOTTOM 1.4 mm 13 mm 11 mm SPANSION INC BGA 13 X 11 MM, 1 MM PITCH, LEAD FREE, FBGA-64 64 compliant 3A991.B.1.A 8542.32.00.51 Spansion
AM29F800BT-70EI
Spansion
$80.1324 No No Obsolete 8.3886 Mbit 16 16K,8K,32K,64K 512KX16 5 V 70 ns FLASH TOP BOOT BLOCK 8 TOP YES YES 1000000 Write/Erase Cycles 1 1,2,1,15 512000 524.288 k ASYNCHRONOUS PARALLEL 5 V YES 1 mA 60 µA 5.5 V 4.5 V CMOS INDUSTRIAL YES NOR TYPE R-PDSO-G48 Not Qualified e0 3 85 °C -40 °C 260 48 PLASTIC/EPOXY TSSOP TSSOP48,.8,20 RECTANGULAR SMALL OUTLINE, THIN PROFILE, SHRINK PITCH YES TIN LEAD GULL WING 500 µm DUAL 1.2 mm 18.4 mm 12 mm SPANSION INC TSOP1 MO-142DD, TSOP-48 48 not_compliant EAR99 8542.32.00.51
S29CD032J0RQFM032
Spansion
Check for Price Obsolete 33.5544 Mbit 32 2K,16K 1MX32 2.6 V 54 ns 75 MHz FLASH BOTTOM YES YES YES 20 1000000 Write/Erase Cycles 1 16,62 1000000 1.0486 M SYNCHRONOUS 3-STATE PARALLEL 2.6 V YES 60 µA 90 µA 2.75 V 2.5 V CMOS YES NOR TYPE 60 ns R-PQFP-G80 125 °C -40 °C 80 PLASTIC/EPOXY QFP QFP80,.7X.9,32 RECTANGULAR FLATPACK YES GULL WING 800 µm QUAD 3.35 mm 20 mm 14 mm SPANSION INC compliant EAR99 8542.32.00.51
S25FL256SAGBHIA03
Spansion
Check for Price Yes Transferred 268.4355 Mbit 8 32MX8 3 V 133 MHz FLASH ALSO CONFIGURABLE AS 128M X 1 2 20 100000 Write/Erase Cycles 1 32000000 33.5544 M SYNCHRONOUS 3-STATE SERIAL 3 V SPI 100 µA 100 µA 3.6 V 2.7 V CMOS INDUSTRIAL NOR TYPE 500 ms HARDWARE/SOFTWARE R-PBGA-B24 Not Qualified 85 °C -40 °C 24 PLASTIC/EPOXY TBGA BGA24,5X5,40 RECTANGULAR GRID ARRAY, THIN PROFILE YES BALL 1 mm BOTTOM 1.2 mm 8 mm 6 mm SPANSION INC BGA FBGA-24 24 compliant 3A991.B.1.A 8542.32.00.51