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S29GL128P90TFCR10
Spansion
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$2.1200 | Yes | Yes | Transferred | 134.2177 Mbit | 1 | 128K | 128MX1 | 3.3 V | 90 ns | FLASH | 8 | YES | YES | YES | 1 | 128 | 128000000 | 134.2177 M | ASYNCHRONOUS | 8/16 words | PARALLEL | 3 V | YES | 5 µA | 110 µA | 3.6 V | 3 V | CMOS | OTHER | YES | NOR TYPE | R-PDSO-G56 | Not Qualified | e3 | 3 | 85 °C | 260 | 40 | 56 | PLASTIC/EPOXY | HTSSOP | TSSOP56,.8,20 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH | YES | MATTE TIN | GULL WING | 500 µm | DUAL | 1.2 mm | 18.4 mm | 14 mm | SPANSION INC | TSOP1 | 20 X 14 MM, LEAD FREE, MO-142EC, TSOP-56 | 56 | compliant | 3A991.B.1.A | 8542.32.00.51 | |||||||||||||
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S25FL256SAGBHI210
Spansion
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$2.1600 | Yes | Transferred | 268.4355 Mbit | 8 | 32MX8 | 3 V | 133 MHz | FLASH | ALSO CONFIGURABLE AS 128M X 1 | 2 | 20 | 100000 Write/Erase Cycles | 1 | 32000000 | 33.5544 M | SYNCHRONOUS | 3-STATE | SERIAL | 3 V | SPI | 100 µA | 100 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | NOR TYPE | 500 ms | HARDWARE/SOFTWARE | R-PBGA-B24 | Not Qualified | 85 °C | -40 °C | 24 | PLASTIC/EPOXY | TBGA | BGA24,5X5,40 | RECTANGULAR | GRID ARRAY, THIN PROFILE | YES | BALL | 1 mm | BOTTOM | 1.2 mm | 8 mm | 6 mm | SPANSION INC | BGA | FBGA-24 | 24 | compliant | 3A991.B.1.A | 8542.32.00.51 | |||||||||||||||||||
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S29JL032J70TFI210
Spansion
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$2.1975 | Yes | Transferred | 33.5544 Mbit | 16 | 8K,64K | 2MX16 | 3 V | 70 ns | FLASH | TOP BOOT BLOCK | 8 | TOP | YES | YES | YES | 1 | 8,63 | 2000000 | 2.0972 M | SYNCHRONOUS | PARALLEL | 3 V | YES | 5 µA | 45 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | YES | NOR TYPE | R-PDSO-G48 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 260 | 40 | 48 | PLASTIC/EPOXY | TSSOP | TSSOP48,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | MATTE TIN | GULL WING | 500 µm | DUAL | 1.2 mm | 18.4 mm | 12 mm | SPANSION INC | TSOP1 | LEAD FREE, MO-142(D)DD, TSOP-48 | 48 | compliant | 3A991.B.1.A | 8542.32.00.51 | Spansion | |||||||||||
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S29GL128P90TFIR20
Spansion
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$2.2900 | Yes | Yes | Transferred | 134.2177 Mbit | 1 | 128K | 128MX1 | 3.3 V | 90 ns | FLASH | 8 | YES | YES | YES | 1 | 128 | 128000000 | 134.2177 M | ASYNCHRONOUS | 8/16 words | PARALLEL | 3 V | YES | 5 µA | 110 µA | 3.6 V | 3 V | CMOS | INDUSTRIAL | YES | NOR TYPE | R-PDSO-G56 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 260 | 40 | 56 | PLASTIC/EPOXY | HTSSOP | TSSOP56,.8,20 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH | YES | MATTE TIN | GULL WING | 500 µm | DUAL | 1.2 mm | 18.4 mm | 14 mm | SPANSION INC | TSOP1 | 20 X 14 MM, LEAD FREE, MO-142EC, TSOP-56 | 56 | compliant | 3A991.B.1.A | 8542.32.00.51 | Spansion | |||||||||||
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S29GL128P11TFI020
Spansion
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$2.2900 | Yes | Yes | Transferred | 134.2177 Mbit | 1 | 128K | 128MX1 | 3 V | 110 ns | FLASH | 8 | YES | YES | YES | 1 | 128 | 128000000 | 134.2177 M | ASYNCHRONOUS | 8/16 words | PARALLEL | 3 V | YES | 5 µA | 110 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | YES | NOR TYPE | R-PDSO-G56 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 260 | 40 | 56 | PLASTIC/EPOXY | HTSSOP | TSSOP56,.8,20 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH | YES | MATTE TIN | GULL WING | 500 µm | DUAL | 1.2 mm | 18.4 mm | 14 mm | SPANSION INC | TSOP1 | 20 X 14 MM, LEAD FREE, MO-142EC, TSOP-56 | 56 | compliant | 3A991.B.1.A | 8542.32.00.51 | Spansion | |||||||||||
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S29GL128P11TFI010
Spansion
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$2.2900 | Yes | Yes | Transferred | 134.2177 Mbit | 1 | 128K | 128MX1 | 3 V | 110 ns | FLASH | 8 | YES | YES | YES | 1 | 128 | 128000000 | 134.2177 M | ASYNCHRONOUS | 8/16 words | PARALLEL | 3 V | YES | 5 µA | 110 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | YES | NOR TYPE | R-PDSO-G56 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 260 | 40 | 56 | PLASTIC/EPOXY | HTSSOP | TSSOP56,.8,20 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH | YES | MATTE TIN | GULL WING | 500 µm | DUAL | 1.2 mm | 18.4 mm | 14 mm | SPANSION INC | TSOP1 | 20 X 14 MM, LEAD FREE, MO-142EC, TSOP-56 | 56 | compliant | 3A991.B.1.A | 8542.32.00.51 | Spansion | |||||||||||
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S29GL128P10TFI020
Spansion
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$2.4093 | Yes | Yes | Transferred | 134.2177 Mbit | 1 | 128K | 128MX1 | 3 V | 100 ns | FLASH | 8 | YES | YES | YES | 1 | 128 | 128000000 | 134.2177 M | ASYNCHRONOUS | 8/16 words | PARALLEL | 3 V | YES | 5 µA | 110 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | YES | NOR TYPE | R-PDSO-G56 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 260 | 40 | 56 | PLASTIC/EPOXY | HTSSOP | TSSOP56,.8,20 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH | YES | MATTE TIN | GULL WING | 500 µm | DUAL | 1.2 mm | 18.4 mm | 14 mm | SPANSION INC | TSOP1 | 20 X 14 MM, LEAD FREE, MO-142EC, TSOP-56 | 56 | compliant | 3A991.B.1.A | 8542.32.00.51 | Spansion | |||||||||||
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S29GL128P11FFI010
Spansion
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$2.4200 | Yes | Yes | Transferred | 134.2177 Mbit | 1 | 128K | 128MX1 | 3 V | 110 ns | FLASH | 8 | YES | YES | YES | 1 | 128 | 128000000 | 134.2177 M | ASYNCHRONOUS | 8/16 words | PARALLEL | 3 V | YES | 5 µA | 110 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | YES | NOR TYPE | R-PBGA-B64 | Not Qualified | e1 | 3 | 85 °C | -40 °C | 260 | 40 | 64 | PLASTIC/EPOXY | LBGA | BGA64,8X8,40 | RECTANGULAR | GRID ARRAY, LOW PROFILE | YES | TIN SILVER COPPER | BALL | 1 mm | BOTTOM | 1.4 mm | 13 mm | 11 mm | SPANSION INC | BGA | 13 X 11 MM, 1 MM PITCH, LEAD FREE, FBGA-64 | 64 | compliant | 3A991.B.1.A | 8542.32.00.51 | Spansion | |||||||||||
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S29GL128P10FFI020
Spansion
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$2.4200 | Yes | Yes | Transferred | 134.2177 Mbit | 1 | 128K | 128MX1 | 3 V | 100 ns | FLASH | 8 | YES | YES | YES | 1 | 128 | 128000000 | 134.2177 M | ASYNCHRONOUS | 8/16 words | PARALLEL | 3 V | YES | 5 µA | 110 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | YES | NOR TYPE | R-PBGA-B64 | Not Qualified | e1 | 3 | 85 °C | -40 °C | 260 | 40 | 64 | PLASTIC/EPOXY | LBGA | BGA64,8X8,40 | RECTANGULAR | GRID ARRAY, LOW PROFILE | YES | TIN SILVER COPPER | BALL | 1 mm | BOTTOM | 1.4 mm | 13 mm | 11 mm | SPANSION INC | BGA | 13 X 11 MM, 1 MM PITCH, LEAD FREE, FBGA-64 | 64 | compliant | 3A991.B.1.A | 8542.32.00.51 | Spansion | |||||||||||
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S29GL128P11FFI020
Spansion
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$2.4200 | Yes | Yes | Transferred | 134.2177 Mbit | 1 | 128K | 128MX1 | 3 V | 110 ns | FLASH | 8 | YES | YES | YES | 1 | 128 | 128000000 | 134.2177 M | ASYNCHRONOUS | 8/16 words | PARALLEL | 3 V | YES | 5 µA | 110 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | YES | NOR TYPE | R-PBGA-B64 | Not Qualified | e1 | 3 | 85 °C | -40 °C | 260 | 40 | 64 | PLASTIC/EPOXY | LBGA | BGA64,8X8,40 | RECTANGULAR | GRID ARRAY, LOW PROFILE | YES | TIN SILVER COPPER | BALL | 1 mm | BOTTOM | 1.4 mm | 13 mm | 11 mm | SPANSION INC | BGA | 13 X 11 MM, 1 MM PITCH, LEAD FREE, FBGA-64 | 64 | compliant | 3A991.B.1.A | 8542.32.00.51 |