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Manufacturer: Spansion
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S29GL128P90TFCR10
Spansion
$2.1200 Yes Yes Transferred 134.2177 Mbit 1 128K 128MX1 3.3 V 90 ns FLASH 8 YES YES YES 1 128 128000000 134.2177 M ASYNCHRONOUS 8/16 words PARALLEL 3 V YES 5 µA 110 µA 3.6 V 3 V CMOS OTHER YES NOR TYPE R-PDSO-G56 Not Qualified e3 3 85 °C 260 40 56 PLASTIC/EPOXY HTSSOP TSSOP56,.8,20 RECTANGULAR SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH YES MATTE TIN GULL WING 500 µm DUAL 1.2 mm 18.4 mm 14 mm SPANSION INC TSOP1 20 X 14 MM, LEAD FREE, MO-142EC, TSOP-56 56 compliant 3A991.B.1.A 8542.32.00.51
S25FL256SAGBHI210
Spansion
$2.1600 Yes Transferred 268.4355 Mbit 8 32MX8 3 V 133 MHz FLASH ALSO CONFIGURABLE AS 128M X 1 2 20 100000 Write/Erase Cycles 1 32000000 33.5544 M SYNCHRONOUS 3-STATE SERIAL 3 V SPI 100 µA 100 µA 3.6 V 2.7 V CMOS INDUSTRIAL NOR TYPE 500 ms HARDWARE/SOFTWARE R-PBGA-B24 Not Qualified 85 °C -40 °C 24 PLASTIC/EPOXY TBGA BGA24,5X5,40 RECTANGULAR GRID ARRAY, THIN PROFILE YES BALL 1 mm BOTTOM 1.2 mm 8 mm 6 mm SPANSION INC BGA FBGA-24 24 compliant 3A991.B.1.A 8542.32.00.51
S29JL032J70TFI210
Spansion
$2.1975 Yes Transferred 33.5544 Mbit 16 8K,64K 2MX16 3 V 70 ns FLASH TOP BOOT BLOCK 8 TOP YES YES YES 1 8,63 2000000 2.0972 M SYNCHRONOUS PARALLEL 3 V YES 5 µA 45 µA 3.6 V 2.7 V CMOS INDUSTRIAL YES NOR TYPE R-PDSO-G48 Not Qualified e3 3 85 °C -40 °C 260 40 48 PLASTIC/EPOXY TSSOP TSSOP48,.8,20 RECTANGULAR SMALL OUTLINE, THIN PROFILE, SHRINK PITCH YES MATTE TIN GULL WING 500 µm DUAL 1.2 mm 18.4 mm 12 mm SPANSION INC TSOP1 LEAD FREE, MO-142(D)DD, TSOP-48 48 compliant 3A991.B.1.A 8542.32.00.51 Spansion
S29GL128P90TFIR20
Spansion
$2.2900 Yes Yes Transferred 134.2177 Mbit 1 128K 128MX1 3.3 V 90 ns FLASH 8 YES YES YES 1 128 128000000 134.2177 M ASYNCHRONOUS 8/16 words PARALLEL 3 V YES 5 µA 110 µA 3.6 V 3 V CMOS INDUSTRIAL YES NOR TYPE R-PDSO-G56 Not Qualified e3 3 85 °C -40 °C 260 40 56 PLASTIC/EPOXY HTSSOP TSSOP56,.8,20 RECTANGULAR SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH YES MATTE TIN GULL WING 500 µm DUAL 1.2 mm 18.4 mm 14 mm SPANSION INC TSOP1 20 X 14 MM, LEAD FREE, MO-142EC, TSOP-56 56 compliant 3A991.B.1.A 8542.32.00.51 Spansion
S29GL128P11TFI020
Spansion
$2.2900 Yes Yes Transferred 134.2177 Mbit 1 128K 128MX1 3 V 110 ns FLASH 8 YES YES YES 1 128 128000000 134.2177 M ASYNCHRONOUS 8/16 words PARALLEL 3 V YES 5 µA 110 µA 3.6 V 2.7 V CMOS INDUSTRIAL YES NOR TYPE R-PDSO-G56 Not Qualified e3 3 85 °C -40 °C 260 40 56 PLASTIC/EPOXY HTSSOP TSSOP56,.8,20 RECTANGULAR SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH YES MATTE TIN GULL WING 500 µm DUAL 1.2 mm 18.4 mm 14 mm SPANSION INC TSOP1 20 X 14 MM, LEAD FREE, MO-142EC, TSOP-56 56 compliant 3A991.B.1.A 8542.32.00.51 Spansion
S29GL128P11TFI010
Spansion
$2.2900 Yes Yes Transferred 134.2177 Mbit 1 128K 128MX1 3 V 110 ns FLASH 8 YES YES YES 1 128 128000000 134.2177 M ASYNCHRONOUS 8/16 words PARALLEL 3 V YES 5 µA 110 µA 3.6 V 2.7 V CMOS INDUSTRIAL YES NOR TYPE R-PDSO-G56 Not Qualified e3 3 85 °C -40 °C 260 40 56 PLASTIC/EPOXY HTSSOP TSSOP56,.8,20 RECTANGULAR SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH YES MATTE TIN GULL WING 500 µm DUAL 1.2 mm 18.4 mm 14 mm SPANSION INC TSOP1 20 X 14 MM, LEAD FREE, MO-142EC, TSOP-56 56 compliant 3A991.B.1.A 8542.32.00.51 Spansion
S29GL128P10TFI020
Spansion
$2.4093 Yes Yes Transferred 134.2177 Mbit 1 128K 128MX1 3 V 100 ns FLASH 8 YES YES YES 1 128 128000000 134.2177 M ASYNCHRONOUS 8/16 words PARALLEL 3 V YES 5 µA 110 µA 3.6 V 2.7 V CMOS INDUSTRIAL YES NOR TYPE R-PDSO-G56 Not Qualified e3 3 85 °C -40 °C 260 40 56 PLASTIC/EPOXY HTSSOP TSSOP56,.8,20 RECTANGULAR SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH YES MATTE TIN GULL WING 500 µm DUAL 1.2 mm 18.4 mm 14 mm SPANSION INC TSOP1 20 X 14 MM, LEAD FREE, MO-142EC, TSOP-56 56 compliant 3A991.B.1.A 8542.32.00.51 Spansion
S29GL128P11FFI010
Spansion
$2.4200 Yes Yes Transferred 134.2177 Mbit 1 128K 128MX1 3 V 110 ns FLASH 8 YES YES YES 1 128 128000000 134.2177 M ASYNCHRONOUS 8/16 words PARALLEL 3 V YES 5 µA 110 µA 3.6 V 2.7 V CMOS INDUSTRIAL YES NOR TYPE R-PBGA-B64 Not Qualified e1 3 85 °C -40 °C 260 40 64 PLASTIC/EPOXY LBGA BGA64,8X8,40 RECTANGULAR GRID ARRAY, LOW PROFILE YES TIN SILVER COPPER BALL 1 mm BOTTOM 1.4 mm 13 mm 11 mm SPANSION INC BGA 13 X 11 MM, 1 MM PITCH, LEAD FREE, FBGA-64 64 compliant 3A991.B.1.A 8542.32.00.51 Spansion
S29GL128P10FFI020
Spansion
$2.4200 Yes Yes Transferred 134.2177 Mbit 1 128K 128MX1 3 V 100 ns FLASH 8 YES YES YES 1 128 128000000 134.2177 M ASYNCHRONOUS 8/16 words PARALLEL 3 V YES 5 µA 110 µA 3.6 V 2.7 V CMOS INDUSTRIAL YES NOR TYPE R-PBGA-B64 Not Qualified e1 3 85 °C -40 °C 260 40 64 PLASTIC/EPOXY LBGA BGA64,8X8,40 RECTANGULAR GRID ARRAY, LOW PROFILE YES TIN SILVER COPPER BALL 1 mm BOTTOM 1.4 mm 13 mm 11 mm SPANSION INC BGA 13 X 11 MM, 1 MM PITCH, LEAD FREE, FBGA-64 64 compliant 3A991.B.1.A 8542.32.00.51 Spansion
S29GL128P11FFI020
Spansion
$2.4200 Yes Yes Transferred 134.2177 Mbit 1 128K 128MX1 3 V 110 ns FLASH 8 YES YES YES 1 128 128000000 134.2177 M ASYNCHRONOUS 8/16 words PARALLEL 3 V YES 5 µA 110 µA 3.6 V 2.7 V CMOS INDUSTRIAL YES NOR TYPE R-PBGA-B64 Not Qualified e1 3 85 °C -40 °C 260 40 64 PLASTIC/EPOXY LBGA BGA64,8X8,40 RECTANGULAR GRID ARRAY, LOW PROFILE YES TIN SILVER COPPER BALL 1 mm BOTTOM 1.4 mm 13 mm 11 mm SPANSION INC BGA 13 X 11 MM, 1 MM PITCH, LEAD FREE, FBGA-64 64 compliant 3A991.B.1.A 8542.32.00.51