Parametric results for: 兰州spa上门服务+【48557З149_Q"Q号】fzo under Flash Memories

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Manufacturer: Spansion Sorted By: Memory Width
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S29GL128P11TFCR13
Spansion
Check for Price Transferred 134.2177 Mbit 1 128MX1 3.3 V 110 ns FLASH 1 128000000 134.2177 M ASYNCHRONOUS PARALLEL 3 V 3.6 V 3 V CMOS OTHER NOR TYPE R-PDSO-G56 Not Qualified 85 °C 56 PLASTIC/EPOXY HTSSOP RECTANGULAR SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH YES GULL WING 500 µm DUAL 1.2 mm 18.4 mm 14 mm SPANSION INC TSOP1 HTSSOP, 56 unknown EAR99 8542.32.00.51
S29GL512P10TFI023
Spansion
Check for Price Yes Yes Obsolete 536.8709 Mbit 1 128K 512MX1 3 V 100 ns FLASH 8 YES YES YES 1 512 512000000 536.8709 M ASYNCHRONOUS 8/16 words PARALLEL 3 V YES 5 µA 110 µA 3.6 V 2.7 V CMOS INDUSTRIAL YES NOR TYPE R-PDSO-G56 Not Qualified e3 3 85 °C -40 °C 260 40 56 PLASTIC/EPOXY HTSSOP TSSOP56,.8,20 RECTANGULAR SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH YES MATTE TIN GULL WING 500 µm DUAL 1.2 mm 18.4 mm 14 mm SPANSION INC TSOP1 HTSSOP, TSSOP56,.8,20 56 unknown EAR99 8542.32.00.51
S29GL128P90FFIR12
Spansion
Check for Price Yes Yes Transferred 134.2177 Mbit 1 128K 128MX1 3.3 V 90 ns FLASH 8 YES YES YES 1 128 128000000 134.2177 M ASYNCHRONOUS 8/16 words PARALLEL 3 V YES 5 µA 110 µA 3.6 V 3 V CMOS INDUSTRIAL YES NOR TYPE R-PBGA-B64 Not Qualified e1 3 85 °C -40 °C 260 40 64 PLASTIC/EPOXY LBGA BGA64,8X8,40 RECTANGULAR GRID ARRAY, LOW PROFILE YES TIN SILVER COPPER BALL 1 mm BOTTOM 1.4 mm 13 mm 11 mm SPANSION INC BGA 13 X 11 MM, 1 MM PITCH, LEAD FREE, FBGA-64 64 compliant EAR99 8542.32.00.51
S29GL512P10FAIR23
Spansion
Check for Price No Transferred 536.8709 Mbit 1 128K 512MX1 3.3 V 100 ns FLASH 8 YES YES YES 1 512 512000000 536.8709 M ASYNCHRONOUS 8/16 words PARALLEL 3 V YES 5 µA 110 µA 3.6 V 3 V CMOS INDUSTRIAL YES NOR TYPE R-PBGA-B64 Not Qualified e0 3 85 °C -40 °C 260 64 PLASTIC/EPOXY LBGA BGA64,8X8,40 RECTANGULAR GRID ARRAY, LOW PROFILE YES TIN LEAD BALL 1 mm BOTTOM 1.4 mm 13 mm 11 mm SPANSION INC BGA LBGA, BGA64,8X8,40 64 not_compliant EAR99 8542.32.00.51
S29GL128P11FAIV20
Spansion
Check for Price No No Transferred 134.2177 Mbit 1 128K 128MX1 3 V 110 ns FLASH 8 YES YES YES 1 128 128000000 134.2177 M ASYNCHRONOUS 8/16 words PARALLEL 3 V YES 5 µA 110 µA 3.6 V 2.7 V CMOS INDUSTRIAL YES NOR TYPE R-PBGA-B64 Not Qualified e0 3 85 °C -40 °C 260 64 PLASTIC/EPOXY LBGA BGA64,8X8,40 RECTANGULAR GRID ARRAY, LOW PROFILE YES TIN LEAD BALL 1 mm BOTTOM 1.4 mm 13 mm 11 mm SPANSION INC BGA 13 X 11 MM, 1 MM PITCH, FBGA-64 64 not_compliant EAR99 8542.32.00.51
S29GL128P90FAIV13
Spansion
Check for Price Transferred 134.2177 Mbit 1 128MX1 3 V 90 ns FLASH 1 128000000 134.2177 M ASYNCHRONOUS PARALLEL 3 V 3.6 V 2.7 V CMOS INDUSTRIAL NOR TYPE R-PBGA-B64 Not Qualified 85 °C -40 °C 64 PLASTIC/EPOXY LBGA RECTANGULAR GRID ARRAY, LOW PROFILE YES BALL 1 mm BOTTOM 1.4 mm 13 mm 11 mm SPANSION INC BGA LBGA, 64 unknown EAR99 8542.32.00.51
S29GL512P10TAIV10
Spansion
Check for Price Transferred 536.8709 Mbit 1 512MX1 3 V 100 ns FLASH 1 512000000 536.8709 M ASYNCHRONOUS PARALLEL 3 V 3.6 V 2.7 V CMOS INDUSTRIAL NOR TYPE R-PDSO-G56 Not Qualified 85 °C -40 °C 56 PLASTIC/EPOXY HTSSOP RECTANGULAR SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH YES GULL WING 500 µm DUAL 1.2 mm 18.4 mm 14 mm SPANSION INC TSOP1 HTSSOP, 56 unknown EAR99 8542.32.00.51
S29GL01GP11TFIV13
Spansion
Check for Price Yes Yes Transferred 1.0737 Gbit 1 128K 1GX1 3 V 110 ns FLASH 8 YES YES YES 1 1K 1000000000 1.0737 G ASYNCHRONOUS 8/16 words PARALLEL 3 V YES 5 µA 90 µA 3.6 V 2.7 V CMOS INDUSTRIAL YES NOR TYPE R-PDSO-G56 Not Qualified e3 3 85 °C -40 °C 260 40 56 PLASTIC/EPOXY HTSSOP TSSOP56,.8,20 RECTANGULAR SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH YES MATTE TIN GULL WING 500 µm DUAL 1.2 mm 18.4 mm 14 mm SPANSION INC TSOP1 HTSSOP, TSSOP56,.8,20 56 unknown EAR99 8542.32.00.51
S29GL01GP12FAIR13
Spansion
Check for Price Transferred 1.0737 Gbit 1 1GX1 3.3 V 120 ns FLASH 1 1000000000 1.0737 G ASYNCHRONOUS PARALLEL 3 V 3.6 V 3 V CMOS INDUSTRIAL NOR TYPE R-PBGA-B64 Not Qualified 85 °C -40 °C 64 PLASTIC/EPOXY LBGA RECTANGULAR GRID ARRAY, LOW PROFILE YES BALL 1 mm BOTTOM 1.4 mm 13 mm 11 mm SPANSION INC BGA LBGA, 64 unknown EAR99 8542.32.00.51
S29GL01GP11FFIR23
Spansion
Check for Price Yes Yes Transferred 1.0737 Gbit 1 128K 1GX1 3.3 V 110 ns FLASH 8 YES YES YES 1 1K 1000000000 1.0737 G ASYNCHRONOUS 8/16 words PARALLEL 3 V YES 5 µA 110 µA 3.6 V 3 V CMOS INDUSTRIAL YES NOR TYPE R-PBGA-B64 Not Qualified e1 3 85 °C -40 °C 260 40 64 PLASTIC/EPOXY LBGA BGA64,8X8,40 RECTANGULAR GRID ARRAY, LOW PROFILE YES TIN SILVER COPPER BALL 1 mm BOTTOM 1.4 mm 13 mm 11 mm SPANSION INC BGA 13 X 11 MM, 1 MM PITCH, LEAD FREE, FBGA-64 64 compliant EAR99 8542.32.00.51