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Manufacturer: Spansion Sorted By: Clock Frequency-Max (fCLK)
Select parts from the table below to compare.
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S70FL01GSAGMFI013
Spansion
Check for Price Yes Transferred 1.0737 Gbit 8 128MX8 133 MHz FLASH 100 1000000 Write/Erase Cycles 128000000 134.2177 M SERIAL 3 V SPI 200 µA 100 µA CMOS INDUSTRIAL NOR TYPE HARDWARE/SOFTWARE R-PDSO-G16 Not Qualified 85 °C -40 °C 16 PLASTIC/EPOXY SOP SOP16,.4 RECTANGULAR SMALL OUTLINE YES GULL WING 1.27 mm DUAL SPANSION INC compliant 3A991.B.1.A 8542.32.00.51
S25FL512SAGBHV210
Spansion
Check for Price Yes Transferred 536.8709 Mbit 4 128MX4 3 V 133 MHz FLASH IT ALSO HAVE MEMORY WIDTH X1 2 20 100000 Write/Erase Cycles 1 128000000 134.2177 M SYNCHRONOUS SERIAL 3 V SPI 300 µA 61 µA 3.6 V 2.7 V CMOS INDUSTRIAL NOR TYPE HARDWARE/SOFTWARE R-PBGA-B24 Not Qualified 105 °C -40 °C 24 PLASTIC/EPOXY TBGA BGA24,5X5,40 RECTANGULAR GRID ARRAY, THIN PROFILE YES BALL 1 mm BOTTOM 1.2 mm 8 mm 6 mm SPANSION INC compliant 3A991.B.1.A 8542.32.00.51 FBGA-24
S25FL256SAGBHIA03
Spansion
Check for Price Yes Transferred 268.4355 Mbit 8 32MX8 3 V 133 MHz FLASH ALSO CONFIGURABLE AS 128M X 1 2 20 100000 Write/Erase Cycles 1 32000000 33.5544 M SYNCHRONOUS 3-STATE SERIAL 3 V SPI 100 µA 100 µA 3.6 V 2.7 V CMOS INDUSTRIAL NOR TYPE 500 ms HARDWARE/SOFTWARE R-PBGA-B24 Not Qualified 85 °C -40 °C 24 PLASTIC/EPOXY TBGA BGA24,5X5,40 RECTANGULAR GRID ARRAY, THIN PROFILE YES BALL 1 mm BOTTOM 1.2 mm 8 mm 6 mm SPANSION INC compliant 3A991.B.1.A 8542.32.00.51 FBGA-24 BGA 24
S25FL128SAGBHIB03
Spansion
Check for Price Yes Transferred 134.2177 Mbit 8 16MX8 3 V 133 MHz FLASH ALSO CONFIGURABLE AS 128M X 1 2 20 100000 Write/Erase Cycles 1 16000000 16.7772 M SYNCHRONOUS 3-STATE SERIAL 3 V SPI 100 µA 100 µA 3.6 V 2.7 V CMOS INDUSTRIAL NOR TYPE 500 ms HARDWARE/SOFTWARE R-PBGA-B24 Not Qualified 85 °C -40 °C 24 PLASTIC/EPOXY TBGA BGA24,5X5,40 RECTANGULAR GRID ARRAY, THIN PROFILE YES BALL 1 mm BOTTOM 1.2 mm 8 mm 6 mm SPANSION INC unknown 3A991.B.1.A 8542.32.00.51 FBGA-24 BGA 24
S25FL128SAGMFVR01
Spansion
Check for Price Yes Transferred 134.2177 Mbit 8 16MX8 3 V 133 MHz FLASH IT ALSO CONFIGURED AS 256M X 1 2 20 100000 Write/Erase Cycles 1 16000000 16.7772 M SYNCHRONOUS 3-STATE SERIAL 3 V SPI 300 µA 100 µA 3.6 V 2.7 V CMOS INDUSTRIAL NOR TYPE 500 ms HARDWARE/SOFTWARE R-PDSO-G16 Not Qualified 105 °C -40 °C 16 PLASTIC/EPOXY SOP SOP16,.4 RECTANGULAR SMALL OUTLINE YES GULL WING 1.27 mm DUAL 2.65 mm 10.3 mm 7.5 mm SPANSION INC compliant EAR99 8542.32.00.51 SOIC-16 SOIC 16
S25FL256SAGBHVB10
Spansion
Check for Price Yes Transferred 268.4355 Mbit 8 32MX8 3 V 133 MHz FLASH ALSO CONFIGURABLE AS 128M X 1 2 20 100000 Write/Erase Cycles 1 32000000 33.5544 M SYNCHRONOUS 3-STATE SERIAL 3 V SPI 300 µA 100 µA 3.6 V 2.7 V CMOS INDUSTRIAL NOR TYPE 500 ms HARDWARE/SOFTWARE R-PBGA-B24 Not Qualified 105 °C -40 °C 24 PLASTIC/EPOXY TBGA BGA24,4X6,40 RECTANGULAR GRID ARRAY, THIN PROFILE YES BALL 1 mm BOTTOM 1.2 mm 8 mm 6 mm SPANSION INC unknown EAR99 8542.32.00.51 TBGA, BGA24,4X6,40 BGA 24
S25FL256SAGBHIB11
Spansion
Check for Price Transferred 268.4355 Mbit 8 32MX8 3 V 133 MHz FLASH 1 32000000 33.5544 M SYNCHRONOUS SERIAL 3 V 3.6 V 2.7 V CMOS INDUSTRIAL NOR TYPE 500 ms R-PBGA-B24 85 °C -40 °C 24 PLASTIC/EPOXY TBGA RECTANGULAR GRID ARRAY, THIN PROFILE YES BALL 1 mm BOTTOM 1.2 mm 8 mm 6 mm SPANSION INC unknown EAR99 8542.32.00.51 TBGA,
S25FL128SAGNFV013
Spansion
Check for Price Yes Transferred 134.2177 Mbit 8 16MX8 3 V 133 MHz FLASH 2 20 100000 Write/Erase Cycles 1 16000000 16.7772 M SYNCHRONOUS 3-STATE SERIAL 3 V SPI 300 µA 100 µA 3.6 V 2.7 V CMOS INDUSTRIAL NOR TYPE 500 ms HARDWARE/SOFTWARE R-PDSO-N8 Not Qualified 105 °C -40 °C 8 PLASTIC/EPOXY HVSON SOLCC8,.3 RECTANGULAR SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE YES NO LEAD 1.27 mm DUAL 800 µm 8 mm 6 mm SPANSION INC compliant EAR99 8542.32.00.51 WSON-8 SON 8
S25FL256SAGMFV003
Spansion
Check for Price Yes Transferred 268.4355 Mbit 8 32MX8 3 V 133 MHz FLASH IT ALSO CONFIGURED AS 256M X 1 2 20 100000 Write/Erase Cycles 1 32000000 33.5544 M SYNCHRONOUS 3-STATE SERIAL 3 V SPI 300 µA 100 µA 3.6 V 2.7 V CMOS INDUSTRIAL NOR TYPE 500 ms HARDWARE/SOFTWARE R-PDSO-G16 Not Qualified 105 °C -40 °C 16 PLASTIC/EPOXY SOP SOP16,.4 RECTANGULAR SMALL OUTLINE YES GULL WING 1.27 mm DUAL 2.65 mm 10.3 mm 7.5 mm SPANSION INC compliant 3A991.B.1.A 8542.32.00.51 SOIC-16 SOIC 16
S70FL01GSAGMFV013
Spansion
Check for Price Yes Transferred 1.0737 Gbit 8 128MX8 133 MHz FLASH 100 1000000 Write/Erase Cycles 128000000 134.2177 M SERIAL 3 V SPI 300 µA 100 µA CMOS INDUSTRIAL NOR TYPE HARDWARE/SOFTWARE R-PDSO-G16 Not Qualified 105 °C -40 °C 16 PLASTIC/EPOXY SOP SOP16,.4 RECTANGULAR SMALL OUTLINE YES GULL WING 1.27 mm DUAL SPANSION INC compliant 3A991.B.1.A 8542.32.00.51