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AM29LV065MU90WHI
Spansion
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Check for Price | No | Obsolete | 67.1089 Mbit | 8 | 8MX8 | 3 V | 90 ns | FLASH | 1 | 8000000 | 8.3886 M | ASYNCHRONOUS | PARALLEL | 3 V | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | NOR TYPE | R-PBGA-B63 | Not Qualified | e0 | 3 | 85 °C | -40 °C | 63 | PLASTIC/EPOXY | TFBGA | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | TIN LEAD | BALL | 800 µm | BOTTOM | 1.2 mm | 12 mm | 11 mm | SPANSION INC | BGA | 11 X 12 MM, 0.80 MM PITCH, FBGA-63 | 63 | compliant | EAR99 | 8542.32.00.51 | |||||||||||||||||
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S25FL064A0LMAI003
Spansion
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Check for Price | No | No | Obsolete | 67.1089 Mbit | 8 | 8MX8 | 3 V | 50 MHz | FLASH | 20 | 100000 Write/Erase Cycles | 1 | 8000000 | 8.3886 M | SYNCHRONOUS | 3-STATE | SERIAL | 3 V | SPI | 10 µA | 13 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | NOR TYPE | HARDWARE/SOFTWARE | R-PDSO-G16 | Not Qualified | e0 | 85 °C | -40 °C | 16 | PLASTIC/EPOXY | SOP | SOP16,.4 | RECTANGULAR | SMALL OUTLINE | YES | TIN LEAD | GULL WING | 1.27 mm | DUAL | 2.65 mm | 10.3 mm | 7.5 mm | SPANSION INC | SOIC | 0.300 INCH, PLASTIC, MS-013AA, SOP-16 | 16 | unknown | EAR99 | 8542.32.00.51 | |||||||||
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S29GL064S70BHI043
Spansion
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Check for Price | Transferred | 67.1089 Mbit | 8 | 8MX8 | 3 V | 70 ns | FLASH | BOTTOM | 1 | 8000000 | 8.3886 M | ASYNCHRONOUS | PARALLEL | 3 V | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | NOR TYPE | R-PBGA-B48 | 85 °C | -40 °C | 48 | PLASTIC/EPOXY | VFBGA | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | YES | BALL | 800 µm | BOTTOM | 1 mm | 8.15 mm | 6.15 mm | SPANSION INC | BGA-48 | unknown | EAR99 | 8542.32.00.51 | |||||||||||||||||||||||
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AM30LV0064DK40TBDD
Spansion
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Check for Price | Yes | Obsolete | 67.1089 Mbit | 8 | 8MX8 | 3 V | 35 ns | FLASH | MINIMUM 100K PROGRAM/ERASE CYCLES; 10 YEAR DATA RETENTION | 10 | 1 | 8000000 | 8.3886 M | ASYNCHRONOUS | PARALLEL | 3 V | 3.6 V | 2.7 V | CMOS | COMMERCIAL | R-PBGA-B40 | Not Qualified | e1 | 3 | 70 °C | 40 | PLASTIC/EPOXY | FBGA | RECTANGULAR | GRID ARRAY, FINE PITCH | YES | TIN SILVER COPPER | BALL | 800 µm | BOTTOM | 15 mm | 8 mm | SPANSION INC | BGA | FBGA, | 40 | compliant | EAR99 | 8542.32.00.51 | ||||||||||||||||||
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AM29LV065GU98RWHK
Spansion
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Check for Price | Yes | Obsolete | 67.1089 Mbit | 8 | 8MX8 | 3.3 V | 90 ns | FLASH | 1 | 8000000 | 8.3886 M | ASYNCHRONOUS | PARALLEL | 3 V | 3.6 V | 3 V | CMOS | MILITARY | NOR TYPE | R-PBGA-B63 | Not Qualified | e1 | 3 | 125 °C | -55 °C | 63 | PLASTIC/EPOXY | TFBGA | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | TIN SILVER COPPER | BALL | 800 µm | BOTTOM | 1.2 mm | 12 mm | 11 mm | SPANSION INC | BGA | 11 X 12 MM, 0.80 MM PITCH, FBGA-63 | 63 | compliant | 3A001.A.2.C | 8542.32.00.51 | |||||||||||||||||
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AM29LV065GU98RFF
Spansion
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Check for Price | Yes | Obsolete | 67.1089 Mbit | 8 | 8MX8 | 3.3 V | 90 ns | FLASH | 1 | 8000000 | 8.3886 M | ASYNCHRONOUS | PARALLEL | 3 V | 3.6 V | 3 V | CMOS | INDUSTRIAL | NOR TYPE | R-PDSO-G48 | Not Qualified | e3 | 85 °C | -40 °C | 48 | PLASTIC/EPOXY | TSOP1-R | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | YES | MATTE TIN | GULL WING | 500 µm | DUAL | 1.2 mm | 18.4 mm | 12 mm | SPANSION INC | TSOP | REVERSE, TSOP-48 | 48 | compliant | EAR99 | 8542.32.00.51 | ||||||||||||||||||
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S29GL064S80FHV043
Spansion
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Check for Price | Transferred | 67.1089 Mbit | 8 | 8MX8 | 3 V | 80 ns | FLASH | BOTTOM | 1 | 8000000 | 8.3886 M | ASYNCHRONOUS | PARALLEL | 3 V | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | NOR TYPE | R-PBGA-B64 | 105 °C | -40 °C | 64 | PLASTIC/EPOXY | LBGA | RECTANGULAR | GRID ARRAY, LOW PROFILE | YES | BALL | 1 mm | BOTTOM | 1.4 mm | 13 mm | 11 mm | SPANSION INC | BGA-64 | unknown | EAR99 | 8542.32.00.51 | |||||||||||||||||||||||
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S25FL164K0XBHV033
Spansion
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Check for Price | Yes | Transferred | 67.1089 Mbit | 8 | 8MX8 | 3 V | 108 MHz | FLASH | ALSO CONFIGURABLE AS 64M X 1 | 2 | 20 | 100000 Write/Erase Cycles | 1 | 8000000 | 8.3886 M | SYNCHRONOUS | 3-STATE | SERIAL | 3 V | SPI | 5 µA | 25 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | NOR TYPE | HARDWARE/SOFTWARE | R-PBGA-B24 | Not Qualified | e1 | 105 °C | -40 °C | 24 | PLASTIC/EPOXY | TBGA | BGA24,4X6,40 | RECTANGULAR | GRID ARRAY, THIN PROFILE | YES | TIN SILVER COPPER | BALL | 1 mm | BOTTOM | 1.2 mm | 8 mm | 6 mm | SPANSION INC | 8 X 6 MM, 1 MM PITCH, GREEN, BGA-24 | compliant | 3A991.B.1.A | 8542.32.00.51 | ||||||||||
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S25FL064P0XMFV001
Spansion
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Check for Price | Yes | Transferred | 67.1089 Mbit | 8 | 8MX8 | 3 V | 104 MHz | FLASH | 20 | 100000 Write/Erase Cycles | 1 | 8000000 | 8.3886 M | SYNCHRONOUS | 3-STATE | SERIAL | 3 V | QSPI | 10 µA | 38 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | NOR TYPE | HARDWARE/SOFTWARE | R-PDSO-G16 | Not Qualified | e3 | 3 | 105 °C | -40 °C | 260 | 40 | 16 | PLASTIC/EPOXY | SOP | SOP16,.4 | RECTANGULAR | SMALL OUTLINE | YES | MATTE TIN | GULL WING | 1.27 mm | DUAL | 2.65 mm | 10.3 mm | 7.5 mm | SPANSION INC | SOIC | 0.300 INCH, LEAD FREE, PLASTIC, MS-013DAA, SOP-16 | 16 | compliant | EAR99 | 8542.32.00.51 | |||||||
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S25FL164K0XMFI000
Spansion
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Check for Price | Yes | Transferred | 67.1089 Mbit | 8 | 8MX8 | 3 V | 108 MHz | FLASH | ALSO CONFIGURABLE AS 64M X 1 | 2 | 20 | 100000 Write/Erase Cycles | 1 | 8000000 | 8.3886 M | SYNCHRONOUS | 3-STATE | SERIAL | 3 V | SPI | 5 µA | 25 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | NOR TYPE | HARDWARE/SOFTWARE | R-PDSO-G16 | Not Qualified | e3 | 85 °C | -40 °C | 16 | PLASTIC/EPOXY | SOP | SOP16,.4 | RECTANGULAR | SMALL OUTLINE | YES | MATTE TIN | GULL WING | 1.27 mm | DUAL | 2.65 mm | 10.3 mm | 7.5 mm | SPANSION INC | 0.300 INCH, GREEN, PLASTIC, MS-013EAA, SOIC-16 | compliant | 3A991.B.1.A | 8542.32.00.51 |