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S25FL512SAGMFVG13
Spansion
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Check for Price | Yes | Transferred | 536.8709 Mbit | 4 | 128MX4 | 3 V | 133 MHz | FLASH | IT ALSO HAVE MEMORY WIDTH X1 | 2 | 20 | 100000 Write/Erase Cycles | 1 | 128000000 | 134.2177 M | SYNCHRONOUS | SERIAL | 3 V | SPI | 100 µA | 61 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | NOR TYPE | HARDWARE/SOFTWARE | R-PDSO-G16 | Not Qualified | 105 °C | -40 °C | 16 | PLASTIC/EPOXY | SOP | SOP16,.4 | RECTANGULAR | SMALL OUTLINE | YES | GULL WING | 1.27 mm | DUAL | 2.65 mm | 10.3 mm | 7.5 mm | SPANSION INC | SOIC-16 | compliant | 3A991.B.1.A | 8542.32.00.51 | ||||||
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S25FL256SAGBHV210
Spansion
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Check for Price | Yes | Transferred | 268.4355 Mbit | 8 | 32MX8 | 3 V | 133 MHz | FLASH | ALSO CONFIGURABLE AS 128M X 1 | 2 | 20 | 100000 Write/Erase Cycles | 1 | 32000000 | 33.5544 M | SYNCHRONOUS | 3-STATE | SERIAL | 3 V | SPI | 300 µA | 100 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | NOR TYPE | 500 ms | HARDWARE/SOFTWARE | R-PBGA-B24 | Not Qualified | 105 °C | -40 °C | 24 | PLASTIC/EPOXY | TBGA | BGA24,5X5,40 | RECTANGULAR | GRID ARRAY, THIN PROFILE | YES | BALL | 1 mm | BOTTOM | 1.2 mm | 8 mm | 6 mm | SPANSION INC | TBGA, BGA24,5X5,40 | unknown | EAR99 | 8542.32.00.51 | BGA | 24 | ||
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S25FL128SAGBHVD13
Spansion
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Check for Price | Yes | Transferred | 134.2177 Mbit | 8 | 16MX8 | 3 V | 133 MHz | FLASH | ALSO CONFIGURABLE AS 128M X 1 | 2 | 20 | 100000 Write/Erase Cycles | 1 | 16000000 | 16.7772 M | SYNCHRONOUS | 3-STATE | SERIAL | 3 V | SPI | 300 µA | 100 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | NOR TYPE | 500 ms | HARDWARE/SOFTWARE | R-PBGA-B24 | Not Qualified | 105 °C | -40 °C | 24 | PLASTIC/EPOXY | TBGA | BGA24,4X6,40 | RECTANGULAR | GRID ARRAY, THIN PROFILE | YES | BALL | 1 mm | BOTTOM | 1.2 mm | 8 mm | 6 mm | SPANSION INC | TBGA, BGA24,4X6,40 | unknown | EAR99 | 8542.32.00.51 | BGA | 24 | ||
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S25FL512SAGBHVB13
Spansion
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Check for Price | Yes | Transferred | 536.8709 Mbit | 4 | 128MX4 | 3 V | 133 MHz | FLASH | IT ALSO HAVE MEMORY WIDTH X1 | 2 | 20 | 100000 Write/Erase Cycles | 1 | 128000000 | 134.2177 M | SYNCHRONOUS | SERIAL | 3 V | SPI | 300 µA | 61 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | NOR TYPE | HARDWARE/SOFTWARE | R-PBGA-B24 | Not Qualified | 105 °C | -40 °C | 24 | PLASTIC/EPOXY | TBGA | BGA24,4X6,40 | RECTANGULAR | GRID ARRAY, THIN PROFILE | YES | BALL | 1 mm | BOTTOM | 1.2 mm | 8 mm | 6 mm | SPANSION INC | FBGA-24 | compliant | 3A991.B.1.A | 8542.32.00.51 | ||||||
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S25FL256SDPMFIR13
Spansion
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Check for Price | Transferred | 268.4355 Mbit | 8 | 32MX8 | 3 V | 133 MHz | FLASH | 1 | 32000000 | 33.5544 M | SYNCHRONOUS | 3-STATE | SERIAL | 3 V | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | NOR TYPE | 85 °C | -40 °C | SOP | 1.27 mm | 2.65 mm | 10.3 mm | 7.5 mm | SPANSION INC | 0.300 INCH, LEAD FREE, PLASTIC, MS-013EAA, SOIC-16 | unknown | 3A991.B.1.A | 8542.32.00.51 | SOIC | 16 | ||||||||||||||||||||||
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S25FL256SAGBHIB00
Spansion
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Check for Price | Yes | Transferred | 268.4355 Mbit | 8 | 32MX8 | 3 V | 133 MHz | FLASH | ALSO CONFIGURABLE AS 128M X 1 | 2 | 20 | 100000 Write/Erase Cycles | 1 | 32000000 | 33.5544 M | SYNCHRONOUS | 3-STATE | SERIAL | 3 V | SPI | 100 µA | 100 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | NOR TYPE | 500 ms | HARDWARE/SOFTWARE | R-PBGA-B24 | Not Qualified | 85 °C | -40 °C | 24 | PLASTIC/EPOXY | TBGA | BGA24,4X6,40 | RECTANGULAR | GRID ARRAY, THIN PROFILE | YES | BALL | 1 mm | BOTTOM | 1.2 mm | 8 mm | 6 mm | SPANSION INC | FBGA-24 | compliant | 3A991.B.1.A | 8542.32.00.51 | BGA | 24 | ||
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S25FL256SDPMFIG10
Spansion
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Check for Price | Yes | Transferred | 268.4355 Mbit | 8 | 32MX8 | 3 V | 133 MHz | FLASH | 20 | 100000 Write/Erase Cycles | 1 | 32000000 | 33.5544 M | SYNCHRONOUS | SERIAL | 3 V | SPI | 100 µA | 100 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | NOR TYPE | 500 ms | HARDWARE/SOFTWARE | R-PDSO-G16 | Not Qualified | 85 °C | -40 °C | 16 | PLASTIC/EPOXY | SOP | SOP16,.4 | RECTANGULAR | SMALL OUTLINE | YES | GULL WING | 1.27 mm | DUAL | 2.65 mm | 10.3 mm | 7.5 mm | SPANSION INC | SOIC-16 | compliant | 3A991.B.1.A | 8542.32.00.51 | |||||||
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S25FL128SAGBHVB03
Spansion
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Check for Price | Yes | Transferred | 134.2177 Mbit | 8 | 16MX8 | 3 V | 133 MHz | FLASH | ALSO CONFIGURABLE AS 128M X 1 | 2 | 20 | 100000 Write/Erase Cycles | 1 | 16000000 | 16.7772 M | SYNCHRONOUS | 3-STATE | SERIAL | 3 V | SPI | 300 µA | 100 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | NOR TYPE | 500 ms | HARDWARE/SOFTWARE | R-PBGA-B24 | Not Qualified | 105 °C | -40 °C | 24 | PLASTIC/EPOXY | TBGA | BGA24,5X5,40 | RECTANGULAR | GRID ARRAY, THIN PROFILE | YES | BALL | 1 mm | BOTTOM | 1.2 mm | 8 mm | 6 mm | SPANSION INC | FBGA-24 | compliant | EAR99 | 8542.32.00.51 | BGA | 24 | ||
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S70FL512SAGMFI013
Spansion
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Check for Price | Obsolete | 536.8709 Mbit | 1 | 512MX1 | 3 V | 133 MHz | FLASH | 20 | 1 | 512000000 | 536.8709 M | SYNCHRONOUS | SERIAL | 3 V | 20 µA | 44 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | R-PDSO-G16 | 85 °C | -40 °C | 16 | PLASTIC/EPOXY | SOP | SOP16,.4 | RECTANGULAR | SMALL OUTLINE | YES | GULL WING | 1.27 mm | DUAL | 2.65 mm | 10.3 mm | 7.5 mm | SPANSION INC | SOP, | unknown | EAR99 | 8542.32.00.51 | SOIC | 16 | ||||||||||||
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S25FL256SDPBHI300
Spansion
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Check for Price | Transferred | 268.4355 Mbit | 8 | 32MX8 | 3 V | 133 MHz | FLASH | 1 | 32000000 | 33.5544 M | SYNCHRONOUS | 3-STATE | SERIAL | 3 V | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | NOR TYPE | R-PBGA-B24 | 85 °C | -40 °C | TBGA | BGA24,4X6,40 | GRID ARRAY, THIN PROFILE | YES | BALL | 1 mm | BOTTOM | 1.2 mm | 8 mm | 6 mm | SPANSION INC | 6 X 8 MM, 1 MM PITCH, LEAD FREE, BGA-24 | unknown | 3A991.B.1.A | 8542.32.00.51 | BGA | 24 |