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S29GL512P12TACR23
Spansion
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Check for Price | Transferred | 536.8709 Mbit | 1 | 512MX1 | 3.3 V | 120 ns | FLASH | 1 | 512000000 | 536.8709 M | ASYNCHRONOUS | PARALLEL | 3 V | 3.6 V | 3 V | CMOS | OTHER | NOR TYPE | R-PDSO-G56 | Not Qualified | 85 °C | 56 | PLASTIC/EPOXY | HTSSOP | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH | YES | GULL WING | 500 µm | DUAL | 1.2 mm | 18.4 mm | 14 mm | SPANSION INC | TSOP1 | HTSSOP, | 56 | unknown | EAR99 | 8542.32.00.51 | ||||||||||||||||||||||
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S29GL512P10FFCR12
Spansion
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Check for Price | Yes | Transferred | 536.8709 Mbit | 1 | 128K | 512MX1 | 3.3 V | 100 ns | FLASH | 8 | YES | YES | YES | 1 | 512 | 512000000 | 536.8709 M | ASYNCHRONOUS | 8/16 words | PARALLEL | 3 V | YES | 5 µA | 110 µA | 3.6 V | 3 V | CMOS | OTHER | YES | NOR TYPE | R-PBGA-B64 | Not Qualified | e1 | 3 | 85 °C | 260 | 40 | 64 | PLASTIC/EPOXY | LBGA | BGA64,8X8,40 | RECTANGULAR | GRID ARRAY, LOW PROFILE | YES | TIN SILVER COPPER | BALL | 1 mm | BOTTOM | 1.4 mm | 13 mm | 11 mm | SPANSION INC | BGA | LBGA, BGA64,8X8,40 | 64 | unknown | EAR99 | 8542.32.00.51 | ||||
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S29GL512P11FFIR22
Spansion
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Check for Price | Yes | Yes | Transferred | 536.8709 Mbit | 1 | 512MX1 | 3.3 V | 110 ns | FLASH | 1 | 512000000 | 536.8709 M | ASYNCHRONOUS | PARALLEL | 3 V | 3.6 V | 3 V | CMOS | INDUSTRIAL | NOR TYPE | R-PBGA-B64 | Not Qualified | e1 | 3 | 85 °C | -40 °C | 64 | PLASTIC/EPOXY | LBGA | RECTANGULAR | GRID ARRAY, LOW PROFILE | YES | TIN SILVER COPPER | BALL | 1 mm | BOTTOM | 1.4 mm | 13 mm | 11 mm | SPANSION INC | BGA | LBGA, | 64 | compliant | EAR99 | 8542.32.00.51 | ||||||||||||||||
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S29GL01GP11FFIV10
Spansion
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Check for Price | Yes | Yes | Transferred | 1.0737 Gbit | 1 | 128K | 1GX1 | 3 V | 110 ns | FLASH | 8 | YES | YES | YES | 1 | 1K | 1000000000 | 1.0737 G | ASYNCHRONOUS | 8/16 words | PARALLEL | 3 V | YES | 5 µA | 90 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | YES | NOR TYPE | R-PBGA-B64 | Not Qualified | e1 | 3 | 85 °C | -40 °C | 260 | 40 | 64 | PLASTIC/EPOXY | LBGA | BGA64,8X8,40 | RECTANGULAR | GRID ARRAY, LOW PROFILE | YES | TIN SILVER COPPER | BALL | 1 mm | BOTTOM | 1.4 mm | 13 mm | 11 mm | SPANSION INC | BGA | LBGA, BGA64,8X8,40 | 64 | unknown | EAR99 | 8542.32.00.51 | ||
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S29GL128P11FFIV23
Spansion
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Check for Price | Yes | Yes | Transferred | 134.2177 Mbit | 1 | 128K | 128MX1 | 3 V | 110 ns | FLASH | 8 | YES | YES | YES | 1 | 128 | 128000000 | 134.2177 M | ASYNCHRONOUS | 8/16 words | PARALLEL | 3 V | YES | 5 µA | 110 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | YES | NOR TYPE | R-PBGA-B64 | Not Qualified | e1 | 3 | 85 °C | -40 °C | 260 | 40 | 64 | PLASTIC/EPOXY | LBGA | BGA64,8X8,40 | RECTANGULAR | GRID ARRAY, LOW PROFILE | YES | TIN SILVER COPPER | BALL | 1 mm | BOTTOM | 1.4 mm | 13 mm | 11 mm | SPANSION INC | BGA | 13 X 11 MM, 1 MM PITCH, LEAD FREE, FBGA-64 | 64 | compliant | EAR99 | 8542.32.00.51 | ||
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S29GL01GP12FFIR20
Spansion
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Check for Price | Transferred | 1.0737 Gbit | 1 | 1GX1 | 3.3 V | 120 ns | FLASH | 1 | 1000000000 | 1.0737 G | ASYNCHRONOUS | PARALLEL | 3 V | 3.6 V | 3 V | CMOS | INDUSTRIAL | NOR TYPE | R-PBGA-B64 | Not Qualified | 85 °C | -40 °C | 64 | PLASTIC/EPOXY | LBGA | RECTANGULAR | GRID ARRAY, LOW PROFILE | YES | BALL | 1 mm | BOTTOM | 1.4 mm | 13 mm | 11 mm | SPANSION INC | BGA | LBGA, | 64 | unknown | EAR99 | 8542.32.00.51 | |||||||||||||||||||||
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S29GL01GP11TFIV20
Spansion
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Check for Price | Yes | Yes | Transferred | 1.0737 Gbit | 1 | 128K | 1GX1 | 3 V | 110 ns | FLASH | 8 | YES | YES | YES | 1 | 1K | 1000000000 | 1.0737 G | ASYNCHRONOUS | 8/16 words | PARALLEL | 3 V | YES | 5 µA | 90 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | YES | NOR TYPE | R-PDSO-G56 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 260 | 40 | 56 | PLASTIC/EPOXY | HTSSOP | TSSOP56,.8,20 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH | YES | MATTE TIN | GULL WING | 500 µm | DUAL | 1.2 mm | 18.4 mm | 14 mm | SPANSION INC | TSOP1 | HTSSOP, TSSOP56,.8,20 | 56 | unknown | EAR99 | 8542.32.00.51 | ||
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S29GL01GP11FFIR23
Spansion
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Check for Price | Yes | Yes | Transferred | 1.0737 Gbit | 1 | 128K | 1GX1 | 3.3 V | 110 ns | FLASH | 8 | YES | YES | YES | 1 | 1K | 1000000000 | 1.0737 G | ASYNCHRONOUS | 8/16 words | PARALLEL | 3 V | YES | 5 µA | 110 µA | 3.6 V | 3 V | CMOS | INDUSTRIAL | YES | NOR TYPE | R-PBGA-B64 | Not Qualified | e1 | 3 | 85 °C | -40 °C | 260 | 40 | 64 | PLASTIC/EPOXY | LBGA | BGA64,8X8,40 | RECTANGULAR | GRID ARRAY, LOW PROFILE | YES | TIN SILVER COPPER | BALL | 1 mm | BOTTOM | 1.4 mm | 13 mm | 11 mm | SPANSION INC | BGA | 13 X 11 MM, 1 MM PITCH, LEAD FREE, FBGA-64 | 64 | compliant | EAR99 | 8542.32.00.51 | ||
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S29GL01GP12FAIR13
Spansion
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Check for Price | Transferred | 1.0737 Gbit | 1 | 1GX1 | 3.3 V | 120 ns | FLASH | 1 | 1000000000 | 1.0737 G | ASYNCHRONOUS | PARALLEL | 3 V | 3.6 V | 3 V | CMOS | INDUSTRIAL | NOR TYPE | R-PBGA-B64 | Not Qualified | 85 °C | -40 °C | 64 | PLASTIC/EPOXY | LBGA | RECTANGULAR | GRID ARRAY, LOW PROFILE | YES | BALL | 1 mm | BOTTOM | 1.4 mm | 13 mm | 11 mm | SPANSION INC | BGA | LBGA, | 64 | unknown | EAR99 | 8542.32.00.51 | |||||||||||||||||||||
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S29GL01GP11TFIV13
Spansion
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Check for Price | Yes | Yes | Transferred | 1.0737 Gbit | 1 | 128K | 1GX1 | 3 V | 110 ns | FLASH | 8 | YES | YES | YES | 1 | 1K | 1000000000 | 1.0737 G | ASYNCHRONOUS | 8/16 words | PARALLEL | 3 V | YES | 5 µA | 90 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | YES | NOR TYPE | R-PDSO-G56 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 260 | 40 | 56 | PLASTIC/EPOXY | HTSSOP | TSSOP56,.8,20 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH | YES | MATTE TIN | GULL WING | 500 µm | DUAL | 1.2 mm | 18.4 mm | 14 mm | SPANSION INC | TSOP1 | HTSSOP, TSSOP56,.8,20 | 56 | unknown | EAR99 | 8542.32.00.51 |