Parametric results for: 红安spa上门服务+485573149_Q)Q号 under Flash Memories

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Manufacturer: Spansion Sorted By: Memory Width
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S29GL01GP11FAIV13
Spansion
Check for Price No No Transferred 1.0737 Gbit 1 128K 1GX1 3 V 110 ns FLASH 8 YES YES YES 1 1K 1000000000 1.0737 G ASYNCHRONOUS 8/16 words PARALLEL 3 V YES 5 µA 90 µA 3.6 V 2.7 V CMOS INDUSTRIAL YES NOR TYPE R-PBGA-B64 Not Qualified e0 3 85 °C -40 °C 260 64 PLASTIC/EPOXY LBGA BGA64,8X8,40 RECTANGULAR GRID ARRAY, LOW PROFILE YES TIN LEAD BALL 1 mm BOTTOM 1.4 mm 13 mm 11 mm SPANSION INC BGA 13 X 11 MM, 1 MM PITCH, FBGA-64 64 not_compliant EAR99 8542.32.00.51
S29GL512P11FAI020
Spansion
Check for Price No No Transferred 536.8709 Mbit 1 128K 512MX1 3 V 110 ns FLASH 8 YES YES YES 1 512 512000000 536.8709 M ASYNCHRONOUS 8/16 words PARALLEL 3 V YES 5 µA 110 µA 3.6 V 2.7 V CMOS INDUSTRIAL YES NOR TYPE R-PBGA-B64 Not Qualified e0 3 85 °C -40 °C 260 64 PLASTIC/EPOXY LBGA BGA64,8X8,40 RECTANGULAR GRID ARRAY, LOW PROFILE YES TIN LEAD BALL 1 mm BOTTOM 1.4 mm 13 mm 11 mm SPANSION INC BGA 13 X 11 MM, 1 MM PITCH, FBGA-64 64 not_compliant 3A991.B.1.A 8542.32.00.51
S29GL512P11FAI013
Spansion
Check for Price No No Transferred 536.8709 Mbit 1 128K 512MX1 3 V 110 ns FLASH 8 YES YES YES 1 512 512000000 536.8709 M ASYNCHRONOUS 8/16 words PARALLEL 3 V YES 5 µA 110 µA 3.6 V 2.7 V CMOS INDUSTRIAL YES NOR TYPE R-PBGA-B64 Not Qualified e0 3 85 °C -40 °C 260 64 PLASTIC/EPOXY LBGA BGA64,8X8,40 RECTANGULAR GRID ARRAY, LOW PROFILE YES TIN LEAD BALL 1 mm BOTTOM 1.4 mm 13 mm 11 mm SPANSION INC BGA LBGA, BGA64,8X8,40 64 not_compliant EAR99 8542.32.00.51
S29GL128P11TFIR10
Spansion
Check for Price Yes Yes Transferred 134.2177 Mbit 1 128K 128MX1 3.3 V 110 ns FLASH 8 YES YES YES 1 128 128000000 134.2177 M ASYNCHRONOUS 8/16 words PARALLEL 3 V YES 5 µA 110 µA 3.6 V 3 V CMOS INDUSTRIAL YES NOR TYPE R-PDSO-G56 Not Qualified e3 3 85 °C -40 °C 260 40 56 PLASTIC/EPOXY HTSSOP TSSOP56,.8,20 RECTANGULAR SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH YES MATTE TIN GULL WING 500 µm DUAL 1.2 mm 18.4 mm 14 mm SPANSION INC TSOP1 HTSSOP, TSSOP56,.8,20 56 unknown EAR99 8542.32.00.51
S29GL01GP11FAIV20
Spansion
Check for Price No No Transferred 1.0737 Gbit 1 128K 1GX1 3 V 110 ns FLASH 8 YES YES YES 1 1K 1000000000 1.0737 G ASYNCHRONOUS 8/16 words PARALLEL 3 V YES 5 µA 90 µA 3.6 V 2.7 V CMOS INDUSTRIAL YES NOR TYPE R-PBGA-B64 Not Qualified e0 3 85 °C -40 °C 260 64 PLASTIC/EPOXY LBGA BGA64,8X8,40 RECTANGULAR GRID ARRAY, LOW PROFILE YES TIN LEAD BALL 1 mm BOTTOM 1.4 mm 13 mm 11 mm SPANSION INC BGA 13 X 11 MM, 1 MM PITCH, FBGA-64 64 not_compliant EAR99 8542.32.00.51
S29GL128P10FFI023
Spansion
Check for Price Yes Yes Transferred 134.2177 Mbit 1 128K 128MX1 3 V 100 ns FLASH 8 YES YES YES 1 128 128000000 134.2177 M ASYNCHRONOUS 8/16 words PARALLEL 3 V YES 5 µA 110 µA 3.6 V 2.7 V CMOS INDUSTRIAL YES NOR TYPE R-PBGA-B64 Not Qualified e1 3 85 °C -40 °C 260 40 64 PLASTIC/EPOXY LBGA BGA64,8X8,40 RECTANGULAR GRID ARRAY, LOW PROFILE YES TIN SILVER COPPER BALL 1 mm BOTTOM 1.4 mm 13 mm 11 mm SPANSION INC BGA 13 X 11 MM, 1 MM PITCH, LEAD FREE, FBGA-64 64 compliant EAR99 8542.32.00.51
S29GL01GP11TFI023
Spansion
Check for Price Yes Yes Transferred 1.0737 Gbit 1 128K 1GX1 3 V 110 ns FLASH 8 YES YES YES 1 1K 1000000000 1.0737 G ASYNCHRONOUS 8/16 words PARALLEL 3 V YES 5 µA 90 µA 3.6 V 2.7 V CMOS INDUSTRIAL YES NOR TYPE R-PDSO-G56 Not Qualified e3 3 85 °C -40 °C 260 40 56 PLASTIC/EPOXY HTSSOP TSSOP56,.8,20 RECTANGULAR SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH YES MATTE TIN GULL WING 500 µm DUAL 1.2 mm 18.4 mm 14 mm SPANSION INC TSOP1 HTSSOP, TSSOP56,.8,20 56 unknown 3A991.B.1.A 8542.32.00.51
S29GL01GP13FAIR22
Spansion
Check for Price Transferred 1.0737 Gbit 1 1GX1 3.3 V 130 ns FLASH 1 1000000000 1.0737 G ASYNCHRONOUS PARALLEL 3 V 3.6 V 3 V CMOS INDUSTRIAL NOR TYPE R-PBGA-B64 Not Qualified 85 °C -40 °C 64 PLASTIC/EPOXY LBGA RECTANGULAR GRID ARRAY, LOW PROFILE YES BALL 1 mm BOTTOM 1.4 mm 13 mm 11 mm SPANSION INC BGA LBGA, 64 unknown EAR99 8542.32.00.51
S29GL512P11TAIV23
Spansion
Check for Price No No Transferred 536.8709 Mbit 1 128K 512MX1 3 V 110 ns FLASH 8 YES YES YES 1 512 512000000 536.8709 M ASYNCHRONOUS 8/16 words PARALLEL 3 V YES 5 µA 110 µA 3.6 V 2.7 V CMOS INDUSTRIAL YES NOR TYPE R-PDSO-G56 Not Qualified e0 3 85 °C -40 °C 260 56 PLASTIC/EPOXY HTSSOP TSSOP56,.8,20 RECTANGULAR SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH YES TIN LEAD GULL WING 500 µm DUAL 1.2 mm 18.4 mm 14 mm SPANSION INC TSOP1 HTSSOP, TSSOP56,.8,20 56 not_compliant EAR99 8542.32.00.51
S29GL512P10FFIV13
Spansion
Check for Price Transferred 536.8709 Mbit 1 512MX1 3 V 100 ns FLASH 1 512000000 536.8709 M ASYNCHRONOUS PARALLEL 3 V 3.6 V 2.7 V CMOS INDUSTRIAL NOR TYPE R-PBGA-B64 Not Qualified 85 °C -40 °C 64 PLASTIC/EPOXY LBGA RECTANGULAR GRID ARRAY, LOW PROFILE YES BALL 1 mm BOTTOM 1.4 mm 13 mm 11 mm SPANSION INC BGA LBGA, 64 unknown EAR99 8542.32.00.51