Parametric results for: 金湖spa上门服务+【485573149_扣<扣】wcpe under Flash Memories

Filter Your Search

1 - 10 of 39,638 results

|
-
-
-
-
-
-
-
-
-
-
-
-
-
-
Manufacturer: Spansion Sorted By: Memory Width
Select parts from the table below to compare.
Compare
Compare
S29GL512P11TFIV20
Spansion
Check for Price Yes Yes Transferred 536.8709 Mbit 1 128K 512MX1 3 V 110 ns FLASH 8 YES YES YES 1 512 512000000 536.8709 M ASYNCHRONOUS 8/16 words PARALLEL 3 V YES 5 µA 110 µA 3.6 V 2.7 V CMOS INDUSTRIAL YES NOR TYPE R-PDSO-G56 Not Qualified e3 3 85 °C -40 °C 260 40 56 PLASTIC/EPOXY HTSSOP TSSOP56,.8,20 RECTANGULAR SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH YES MATTE TIN GULL WING 500 µm DUAL 1.2 mm 18.4 mm 14 mm SPANSION INC TSOP1 20 X 14 MM, LEAD FREE, MO-142EC, TSOP-56 56 compliant EAR99 8542.32.00.51
S29GL512P10FAIR12
Spansion
Check for Price No No Transferred 536.8709 Mbit 1 128K 512MX1 3.3 V 100 ns FLASH 8 YES YES YES 1 512 512000000 536.8709 M ASYNCHRONOUS 8/16 words PARALLEL 3 V YES 5 µA 110 µA 3.6 V 3 V CMOS INDUSTRIAL YES NOR TYPE R-PBGA-B64 Not Qualified e0 3 85 °C -40 °C 260 64 PLASTIC/EPOXY LBGA BGA64,8X8,40 RECTANGULAR GRID ARRAY, LOW PROFILE YES TIN LEAD BALL 1 mm BOTTOM 1.4 mm 13 mm 11 mm SPANSION INC BGA 13 X 11 MM, 1 MM PITCH, FBGA-64 64 not_compliant EAR99 8542.32.00.51
S29GL01GP13FAIR10
Spansion
Check for Price Transferred 1.0737 Gbit 1 1GX1 3.3 V 130 ns FLASH 1 1000000000 1.0737 G ASYNCHRONOUS PARALLEL 3 V 3.6 V 3 V CMOS INDUSTRIAL NOR TYPE R-PBGA-B64 Not Qualified 85 °C -40 °C 64 PLASTIC/EPOXY LBGA RECTANGULAR GRID ARRAY, LOW PROFILE YES BALL 1 mm BOTTOM 1.4 mm 13 mm 11 mm SPANSION INC BGA LBGA, 64 unknown EAR99 8542.32.00.51
S29GL01GP11TACR13
Spansion
Check for Price No Transferred 1.0737 Gbit 1 128K 1GX1 3.3 V 110 ns FLASH 8 YES YES YES 1 1K 1000000000 1.0737 G ASYNCHRONOUS 8/16 words PARALLEL 3 V YES 5 µA 110 µA 3.6 V 3 V CMOS OTHER YES NOR TYPE R-PDSO-G56 Not Qualified e0 3 85 °C 260 56 PLASTIC/EPOXY HTSSOP TSSOP56,.8,20 RECTANGULAR SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH YES TIN LEAD GULL WING 500 µm DUAL 1.2 mm 18.4 mm 14 mm SPANSION INC TSOP1 20 X 14 MM, MO-142EC, TSOP-56 56 not_compliant EAR99 8542.32.00.51
S29GL01GP13TFCR23
Spansion
Check for Price Transferred 1.0737 Gbit 1 1GX1 3.3 V 130 ns FLASH 1 1000000000 1.0737 G ASYNCHRONOUS PARALLEL 3 V 3.6 V 3 V CMOS OTHER NOR TYPE R-PDSO-G56 Not Qualified 85 °C 56 PLASTIC/EPOXY HTSSOP RECTANGULAR SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH YES GULL WING 500 µm DUAL 1.2 mm 18.4 mm 14 mm SPANSION INC TSOP1 HTSSOP, 56 unknown EAR99 8542.32.00.51
S29GL128P11DEI014
Spansion
Check for Price Transferred 134.2177 Mbit 1 128MX1 3 V 110 ns FLASH 1 128000000 134.2177 M ASYNCHRONOUS PARALLEL 3 V 3.6 V 2.7 V CMOS INDUSTRIAL NOR TYPE R-XUUC-N62 Not Qualified 85 °C -40 °C 62 UNSPECIFIED DIE RECTANGULAR UNCASED CHIP YES NO LEAD UPPER SPANSION INC DIE DIE-62 62 unknown EAR99 8542.32.00.51
S29GL128P10TAI023
Spansion
Check for Price No No Transferred 134.2177 Mbit 1 128K 128MX1 3 V 100 ns FLASH 8 YES YES YES 1 128 128000000 134.2177 M ASYNCHRONOUS 8/16 words PARALLEL 3 V YES 5 µA 110 µA 3.6 V 2.7 V CMOS INDUSTRIAL YES NOR TYPE R-PDSO-G56 Not Qualified e0 3 85 °C -40 °C 260 56 PLASTIC/EPOXY HTSSOP TSSOP56,.8,20 RECTANGULAR SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH YES TIN LEAD GULL WING 500 µm DUAL 1.2 mm 18.4 mm 14 mm SPANSION INC TSOP1 20 X 14 MM, MO-142EC, TSOP-56 56 not_compliant EAR99 8542.32.00.51
S29GL512P11TFIR23
Spansion
Check for Price Yes Yes Transferred 536.8709 Mbit 1 512MX1 3.3 V 110 ns FLASH 1 512000000 536.8709 M ASYNCHRONOUS PARALLEL 3 V 3.6 V 3 V CMOS INDUSTRIAL NOR TYPE R-PDSO-G56 Not Qualified e3 3 85 °C -40 °C 56 PLASTIC/EPOXY HTSSOP RECTANGULAR SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH YES MATTE TIN GULL WING 500 µm DUAL 1.2 mm 18.4 mm 14 mm SPANSION INC TSOP1 HTSSOP, 56 compliant EAR99 8542.32.00.51
S29GL01GP13FAIR23
Spansion
Check for Price Transferred 1.0737 Gbit 1 1GX1 3.3 V 130 ns FLASH 1 1000000000 1.0737 G ASYNCHRONOUS PARALLEL 3 V 3.6 V 3 V CMOS INDUSTRIAL NOR TYPE R-PBGA-B64 Not Qualified 85 °C -40 °C 64 PLASTIC/EPOXY LBGA RECTANGULAR GRID ARRAY, LOW PROFILE YES BALL 1 mm BOTTOM 1.4 mm 13 mm 11 mm SPANSION INC BGA LBGA, 64 unknown EAR99 8542.32.00.51
S70FL256P0XMFI011
Spansion
Check for Price Yes Transferred 268.4355 Mbit 1 256MX1 3 V 104 MHz FLASH 20 100000 Write/Erase Cycles 1 256000000 268.4355 M SYNCHRONOUS SERIAL 3 V SPI 20 µA 44 µA 3.6 V 2.7 V CMOS INDUSTRIAL NOR TYPE HARDWARE/SOFTWARE R-PDSO-G16 Not Qualified 85 °C -40 °C 16 PLASTIC/EPOXY SOP SOP16,.4 RECTANGULAR SMALL OUTLINE YES GULL WING 1.27 mm DUAL 2.65 mm 10.3 mm 7.5 mm SPANSION INC SOIC SOP, SOP16,.4 16 unknown 3A991.B.1.A 8542.32.00.71