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S34ML08G101TFV003
Spansion
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Check for Price | Transferred | 8.5899 Gbit | 8 | 128K | 1GX8 | 3.3 V | FLASH | YES | NO | NO | 10 | 1 | 8K | 1000000000 | 1.0737 G | ASYNCHRONOUS | 2K words | PARALLEL | 3.3 V | YES | 10 µA | 35 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | NO | SLC NAND TYPE | R-PDSO-G48 | 105 °C | -40 °C | 48 | PLASTIC/EPOXY | TSSOP | TSSOP48,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | GULL WING | 500 µm | DUAL | 1.2 mm | 18.4 mm | 12 mm | SPANSION INC | 12 X 20 MM, 1.20 MM HEIGHT, LEAD FREE, PLASTIC, MO-142DD, TSOP1-48 | unknown | EAR99 | 8542.32.00.51 | |||||||||||||||
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S29GL01GP11TFIV13
Spansion
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Check for Price | Yes | Yes | Transferred | 1.0737 Gbit | 1 | 128K | 1GX1 | 3 V | 110 ns | FLASH | 8 | YES | YES | YES | 1 | 1K | 1000000000 | 1.0737 G | ASYNCHRONOUS | 8/16 words | PARALLEL | 3 V | YES | 5 µA | 90 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | YES | NOR TYPE | R-PDSO-G56 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 260 | 40 | 56 | PLASTIC/EPOXY | HTSSOP | TSSOP56,.8,20 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH | YES | MATTE TIN | GULL WING | 500 µm | DUAL | 1.2 mm | 18.4 mm | 14 mm | SPANSION INC | HTSSOP, TSSOP56,.8,20 | unknown | EAR99 | 8542.32.00.51 | TSOP1 | 56 | ||||
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S29GL01GP12FAIR13
Spansion
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Check for Price | Transferred | 1.0737 Gbit | 1 | 1GX1 | 3.3 V | 120 ns | FLASH | 1 | 1000000000 | 1.0737 G | ASYNCHRONOUS | PARALLEL | 3 V | 3.6 V | 3 V | CMOS | INDUSTRIAL | NOR TYPE | R-PBGA-B64 | Not Qualified | 85 °C | -40 °C | 64 | PLASTIC/EPOXY | LBGA | RECTANGULAR | GRID ARRAY, LOW PROFILE | YES | BALL | 1 mm | BOTTOM | 1.4 mm | 13 mm | 11 mm | SPANSION INC | LBGA, | unknown | EAR99 | 8542.32.00.51 | BGA | 64 | |||||||||||||||||||||||
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S29GL01GP11FFIR23
Spansion
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Check for Price | Yes | Yes | Transferred | 1.0737 Gbit | 1 | 128K | 1GX1 | 3.3 V | 110 ns | FLASH | 8 | YES | YES | YES | 1 | 1K | 1000000000 | 1.0737 G | ASYNCHRONOUS | 8/16 words | PARALLEL | 3 V | YES | 5 µA | 110 µA | 3.6 V | 3 V | CMOS | INDUSTRIAL | YES | NOR TYPE | R-PBGA-B64 | Not Qualified | e1 | 3 | 85 °C | -40 °C | 260 | 40 | 64 | PLASTIC/EPOXY | LBGA | BGA64,8X8,40 | RECTANGULAR | GRID ARRAY, LOW PROFILE | YES | TIN SILVER COPPER | BALL | 1 mm | BOTTOM | 1.4 mm | 13 mm | 11 mm | SPANSION INC | 13 X 11 MM, 1 MM PITCH, LEAD FREE, FBGA-64 | compliant | EAR99 | 8542.32.00.51 | BGA | 64 | ||||
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S29GL01GP11TFIV20
Spansion
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Check for Price | Yes | Yes | Transferred | 1.0737 Gbit | 1 | 128K | 1GX1 | 3 V | 110 ns | FLASH | 8 | YES | YES | YES | 1 | 1K | 1000000000 | 1.0737 G | ASYNCHRONOUS | 8/16 words | PARALLEL | 3 V | YES | 5 µA | 90 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | YES | NOR TYPE | R-PDSO-G56 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 260 | 40 | 56 | PLASTIC/EPOXY | HTSSOP | TSSOP56,.8,20 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH | YES | MATTE TIN | GULL WING | 500 µm | DUAL | 1.2 mm | 18.4 mm | 14 mm | SPANSION INC | HTSSOP, TSSOP56,.8,20 | unknown | EAR99 | 8542.32.00.51 | TSOP1 | 56 | ||||
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S34ML08G101BHB003
Spansion
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Check for Price | Transferred | 8.5899 Gbit | 8 | 128K | 1GX8 | 3.3 V | FLASH | YES | NO | NO | 10 | 1 | 8K | 1000000000 | 1.0737 G | ASYNCHRONOUS | 2K words | PARALLEL | 3.3 V | YES | 10 µA | 35 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | NO | SLC NAND TYPE | R-PBGA-B63 | 105 °C | -40 °C | AEC-Q100 | 63 | PLASTIC/EPOXY | VFBGA | BGA63,10X12,32 | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | YES | BALL | 800 µm | BOTTOM | 1 mm | 11 mm | 9 mm | SPANSION INC | 9 X 11 MM, 1 MM HEIGHT, LOW HALOGEN AND LEAD FREE, MO-207M, BGA-63 | unknown | EAR99 | 8542.32.00.51 | ||||||||||||||
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S29GL01GP12FACR22
Spansion
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Check for Price | Transferred | 1.0737 Gbit | 1 | 1GX1 | 3.3 V | 120 ns | FLASH | 1 | 1000000000 | 1.0737 G | ASYNCHRONOUS | PARALLEL | 3 V | 3.6 V | 3 V | CMOS | OTHER | NOR TYPE | R-PBGA-B64 | Not Qualified | 85 °C | 64 | PLASTIC/EPOXY | LBGA | RECTANGULAR | GRID ARRAY, LOW PROFILE | YES | BALL | 1 mm | BOTTOM | 1.4 mm | 13 mm | 11 mm | SPANSION INC | LBGA, | unknown | EAR99 | 8542.32.00.51 | BGA | 64 | ||||||||||||||||||||||||
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S29GL01GP11FFIV13
Spansion
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Check for Price | Yes | Yes | Transferred | 1.0737 Gbit | 1 | 128K | 1GX1 | 3 V | 110 ns | FLASH | 8 | YES | YES | YES | 1 | 1K | 1000000000 | 1.0737 G | ASYNCHRONOUS | 8/16 words | PARALLEL | 3 V | YES | 5 µA | 90 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | YES | NOR TYPE | R-PBGA-B64 | Not Qualified | e1 | 3 | 85 °C | -40 °C | 260 | 40 | 64 | PLASTIC/EPOXY | LBGA | BGA64,8X8,40 | RECTANGULAR | GRID ARRAY, LOW PROFILE | YES | TIN SILVER COPPER | BALL | 1 mm | BOTTOM | 1.4 mm | 13 mm | 11 mm | SPANSION INC | LBGA, BGA64,8X8,40 | unknown | EAR99 | 8542.32.00.51 | BGA | 64 | ||||
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S29GL01GP12FAIV20
Spansion
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Check for Price | Transferred | 1.0737 Gbit | 1 | 1GX1 | 3 V | 120 ns | FLASH | 1 | 1000000000 | 1.0737 G | ASYNCHRONOUS | PARALLEL | 3 V | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | NOR TYPE | R-PBGA-B64 | Not Qualified | 85 °C | -40 °C | 64 | PLASTIC/EPOXY | LBGA | RECTANGULAR | GRID ARRAY, LOW PROFILE | YES | BALL | 1 mm | BOTTOM | 1.4 mm | 13 mm | 11 mm | SPANSION INC | LBGA, | unknown | EAR99 | 8542.32.00.51 | BGA | 64 | |||||||||||||||||||||||
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S29GL01GP12TFI023
Spansion
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Check for Price | Yes | Yes | Transferred | 1.0737 Gbit | 1 | 128K | 1GX1 | 3 V | 120 ns | FLASH | 8 | YES | YES | YES | 1 | 1K | 1000000000 | 1.0737 G | ASYNCHRONOUS | 8/16 words | PARALLEL | 3 V | YES | 5 µA | 110 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | YES | NOR TYPE | R-PDSO-G56 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 260 | 40 | 56 | PLASTIC/EPOXY | HTSSOP | TSSOP56,.8,20 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH | YES | MATTE TIN | GULL WING | 500 µm | DUAL | 1.2 mm | 18.4 mm | 14 mm | SPANSION INC | 20 X 14 MM, LEAD FREE, MO-142EC, TSOP-56 | compliant | EAR99 | 8542.32.00.51 | TSOP1 | 56 |