Parametric results for: 鹤壁山城spa哪里好+З19337670_Q_Qkof under Flash Memories

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Manufacturer: Spansion Sorted By: Number of Words Code
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S34MS08G201BHI003
Spansion
Check for Price Transferred 8.5899 Gbit 8 1GX8 1.8 V FLASH 1 1000000000 1.0737 G ASYNCHRONOUS PARALLEL 1.8 V 1.95 V 1.7 V CMOS INDUSTRIAL SLC NAND TYPE R-PBGA-B63 85 °C -40 °C 63 PLASTIC/EPOXY VFBGA RECTANGULAR GRID ARRAY, VERY THIN PROFILE, FINE PITCH YES BALL 800 µm BOTTOM 1 mm 11 mm 9 mm SPANSION INC BGA-63 unknown EAR99 8542.32.00.51
S29GL01GP12TAI013
Spansion
Check for Price No No Transferred 1.0737 Gbit 1 128K 1GX1 3 V 120 ns FLASH 8 YES YES YES 1 1K 1000000000 1.0737 G ASYNCHRONOUS 8/16 words PARALLEL 3 V YES 5 µA 110 µA 3.6 V 2.7 V CMOS INDUSTRIAL YES NOR TYPE R-PDSO-G56 Not Qualified e0 3 85 °C -40 °C 260 56 PLASTIC/EPOXY HTSSOP TSSOP56,.8,20 RECTANGULAR SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH YES TIN LEAD GULL WING 500 µm DUAL 1.2 mm 18.4 mm 14 mm SPANSION INC 20 X 14 MM, MO-142EC, TSOP-56 not_compliant EAR99 8542.32.00.51 TSOP1 56
S29GL01GP11FAIV12
Spansion
Check for Price No No Transferred 1.0737 Gbit 1 128K 1GX1 3 V 110 ns FLASH 8 YES YES YES 1 1K 1000000000 1.0737 G ASYNCHRONOUS 8/16 words PARALLEL 3 V YES 5 µA 90 µA 3.6 V 2.7 V CMOS INDUSTRIAL YES NOR TYPE R-PBGA-B64 Not Qualified e0 3 85 °C -40 °C 260 64 PLASTIC/EPOXY LBGA BGA64,8X8,40 RECTANGULAR GRID ARRAY, LOW PROFILE YES TIN LEAD BALL 1 mm BOTTOM 1.4 mm 13 mm 11 mm SPANSION INC 13 X 11 MM, 1 MM PITCH, FBGA-64 not_compliant EAR99 8542.32.00.51 BGA 64
S29GL01GP12FAIR13
Spansion
Check for Price Transferred 1.0737 Gbit 1 1GX1 3.3 V 120 ns FLASH 1 1000000000 1.0737 G ASYNCHRONOUS PARALLEL 3 V 3.6 V 3 V CMOS INDUSTRIAL NOR TYPE R-PBGA-B64 Not Qualified 85 °C -40 °C 64 PLASTIC/EPOXY LBGA RECTANGULAR GRID ARRAY, LOW PROFILE YES BALL 1 mm BOTTOM 1.4 mm 13 mm 11 mm SPANSION INC LBGA, unknown EAR99 8542.32.00.51 BGA 64
S29GL01GP11TFIV13
Spansion
Check for Price Yes Yes Transferred 1.0737 Gbit 1 128K 1GX1 3 V 110 ns FLASH 8 YES YES YES 1 1K 1000000000 1.0737 G ASYNCHRONOUS 8/16 words PARALLEL 3 V YES 5 µA 90 µA 3.6 V 2.7 V CMOS INDUSTRIAL YES NOR TYPE R-PDSO-G56 Not Qualified e3 3 85 °C -40 °C 260 40 56 PLASTIC/EPOXY HTSSOP TSSOP56,.8,20 RECTANGULAR SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH YES MATTE TIN GULL WING 500 µm DUAL 1.2 mm 18.4 mm 14 mm SPANSION INC HTSSOP, TSSOP56,.8,20 unknown EAR99 8542.32.00.51 TSOP1 56
S29GL01GP11TFIV20
Spansion
Check for Price Yes Yes Transferred 1.0737 Gbit 1 128K 1GX1 3 V 110 ns FLASH 8 YES YES YES 1 1K 1000000000 1.0737 G ASYNCHRONOUS 8/16 words PARALLEL 3 V YES 5 µA 90 µA 3.6 V 2.7 V CMOS INDUSTRIAL YES NOR TYPE R-PDSO-G56 Not Qualified e3 3 85 °C -40 °C 260 40 56 PLASTIC/EPOXY HTSSOP TSSOP56,.8,20 RECTANGULAR SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH YES MATTE TIN GULL WING 500 µm DUAL 1.2 mm 18.4 mm 14 mm SPANSION INC HTSSOP, TSSOP56,.8,20 unknown EAR99 8542.32.00.51 TSOP1 56
S29GL01GP11FFIR23
Spansion
Check for Price Yes Yes Transferred 1.0737 Gbit 1 128K 1GX1 3.3 V 110 ns FLASH 8 YES YES YES 1 1K 1000000000 1.0737 G ASYNCHRONOUS 8/16 words PARALLEL 3 V YES 5 µA 110 µA 3.6 V 3 V CMOS INDUSTRIAL YES NOR TYPE R-PBGA-B64 Not Qualified e1 3 85 °C -40 °C 260 40 64 PLASTIC/EPOXY LBGA BGA64,8X8,40 RECTANGULAR GRID ARRAY, LOW PROFILE YES TIN SILVER COPPER BALL 1 mm BOTTOM 1.4 mm 13 mm 11 mm SPANSION INC 13 X 11 MM, 1 MM PITCH, LEAD FREE, FBGA-64 compliant EAR99 8542.32.00.51 BGA 64
S34ML08G101BHB003
Spansion
Check for Price Transferred 8.5899 Gbit 8 128K 1GX8 3.3 V FLASH YES NO NO 10 1 8K 1000000000 1.0737 G ASYNCHRONOUS 2K words PARALLEL 3.3 V YES 10 µA 35 µA 3.6 V 2.7 V CMOS INDUSTRIAL NO SLC NAND TYPE R-PBGA-B63 105 °C -40 °C AEC-Q100 63 PLASTIC/EPOXY VFBGA BGA63,10X12,32 RECTANGULAR GRID ARRAY, VERY THIN PROFILE, FINE PITCH YES BALL 800 µm BOTTOM 1 mm 11 mm 9 mm SPANSION INC 9 X 11 MM, 1 MM HEIGHT, LOW HALOGEN AND LEAD FREE, MO-207M, BGA-63 unknown EAR99 8542.32.00.51
S29GL01GP12TACR23
Spansion
Check for Price Transferred 1.0737 Gbit 1 1GX1 3.3 V 120 ns FLASH 1 1000000000 1.0737 G ASYNCHRONOUS PARALLEL 3 V 3.6 V 3 V CMOS OTHER NOR TYPE R-PDSO-G56 Not Qualified 85 °C 56 PLASTIC/EPOXY HTSSOP RECTANGULAR SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH YES GULL WING 500 µm DUAL 1.2 mm 18.4 mm 14 mm SPANSION INC HTSSOP, unknown EAR99 8542.32.00.51 TSOP1 56
S29GL01GP13TACR13
Spansion
Check for Price Transferred 1.0737 Gbit 1 1GX1 3.3 V 130 ns FLASH 1 1000000000 1.0737 G ASYNCHRONOUS PARALLEL 3 V 3.6 V 3 V CMOS OTHER NOR TYPE R-PDSO-G56 Not Qualified 85 °C 56 PLASTIC/EPOXY HTSSOP RECTANGULAR SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH YES GULL WING 500 µm DUAL 1.2 mm 18.4 mm 14 mm SPANSION INC HTSSOP, unknown EAR99 8542.32.00.51 TSOP1 56