Parametric results for: FR+257-W3M2 under Digital Transmission Controllers

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MT9076BP1
Microchip Technology Inc
$31.5501 Yes Obsolete 3.3 V CEPT PCM-30/E-1 FRAMER T-1(DS1) 1 98 mA INDUSTRIAL S-PQCC-J68 e3 Not Qualified 85 °C -40 °C 68 PLASTIC/EPOXY QCCJ LDCC68,1.0SQ SQUARE CHIP CARRIER YES MATTE TIN J BEND 1.27 mm QUAD 24.23 mm 24.23 mm 4.57 mm MICROCHIP TECHNOLOGY INC LEAD FREE, PLASTIC, MS-018AE, LCC-68 compliant Microchip
MT9074AP1
Microchip Technology Inc
$32.8246 Yes Obsolete 5 V CEPT PCM-30/E-1 FRAMER T-1(DS1) 1 200 mA INDUSTRIAL S-PQCC-J68 e3 Not Qualified 85 °C -40 °C 68 PLASTIC/EPOXY QCCJ LDCC68,1.0SQ SQUARE CHIP CARRIER YES MATTE TIN J BEND 1.27 mm QUAD 24.23 mm 24.23 mm 4.57 mm MICROCHIP TECHNOLOGY INC LEAD FREE, PLASTIC, MS-018AE, LCC-68 compliant
MT9074AP1
Microsemi Corporation
$33.7583 Yes Yes Transferred 5 V CEPT PCM-30/E-1 FRAMER T-1(DS1) 1 200 mA INDUSTRIAL S-PQCC-J68 e3 Not Qualified 85 °C -40 °C 68 PLASTIC/EPOXY QCCJ LDCC68,1.0SQ SQUARE CHIP CARRIER YES MATTE TIN J BEND 1.27 mm QUAD 24.23 mm 24.23 mm 4.57 mm MICROSEMI CORP LEAD FREE, PLASTIC, MS-018AE, LCC-68 compliant LCC 68 8542.39.00.01
MT9074AL1
Microsemi Corporation
$34.0653 Yes Yes Transferred 5 V CEPT PCM-30/E-1 FRAMER T-1(DS1) 1 200 mA INDUSTRIAL R-PQFP-G100 e3 Not Qualified 85 °C -40 °C 100 PLASTIC/EPOXY QFP QFP100,.7X1.0 RECTANGULAR FLATPACK YES MATTE TIN GULL WING 650 µm QUAD 14 mm 20 mm 3.4 mm MICROSEMI CORP 14 X 20 MM, 2.80 MM HEIGHT, LEAD FREE, MO-112CC-1, MQFP-100 compliant QFP 100 8542.39.00.01
82V2108PXG
Integrated Device Technology Inc
$35.3693 Yes Yes Transferred 3.3 V CMOS FRAMER 1 INDUSTRIAL R-PQFP-G128 e3 Not Qualified 3 85 °C -40 °C 260 30 128 PLASTIC/EPOXY FQFP QFP128,.67X.93,20 RECTANGULAR FLATPACK, FINE PITCH YES MATTE TIN GULL WING 500 µm QUAD 14 mm 20 mm 3.4 mm INTEGRATED DEVICE TECHNOLOGY INC GREEN, PLASTIC, QFP-128 compliant PQFP 128 8542.39.00.01 PXG128 EAR99
PM4358-NGI
Microsemi Corporation
$36.8000 Yes Transferred 1.8 V CMOS FRAMER 1 INDUSTRIAL S-PBGA-B256 3 85 °C -40 °C 256 PLASTIC/EPOXY BGA SQUARE GRID ARRAY YES BALL BOTTOM MICROSEMI CORP BGA, compliant 8542.39.00.01
DS21Q59L+
Maxim Integrated Products
$40.1656 Yes Yes Transferred 3.3 V CMOS CEPT PCM-30/E-1 FRAMER 1 COMMERCIAL S-PQFP-G100 e3 Not Qualified 3 70 °C 260 30 100 PLASTIC/EPOXY LFQFP QFP100,.63SQ,20 SQUARE FLATPACK, LOW PROFILE, FINE PITCH YES MATTE TIN GULL WING 500 µm QUAD 14 mm 14 mm 1.6 mm MAXIM INTEGRATED PRODUCTS INC 14 X 14 MM, ROHS COMPLIANT, LQFP-100 compliant QFP 100 8542.39.00.01 EAR99
82V2108PXG8
Integrated Device Technology Inc
$41.3920 Yes Yes Transferred 3.3 V CMOS FRAMER 1 INDUSTRIAL R-PQFP-G128 e3 Not Qualified 85 °C -40 °C 128 PLASTIC/EPOXY FQFP QFP128,.67X.93,20 RECTANGULAR FLATPACK, FINE PITCH YES MATTE TIN GULL WING 500 µm QUAD 14 mm 20 mm 3.4 mm INTEGRATED DEVICE TECHNOLOGY INC PLASTIC, QFP-128 compliant QFP 128 8542.39.00.01 EAR99
PM4359-NGI
Microsemi Corporation
$42.3200 Yes Transferred 1.8 V CMOS FRAMER 1 INDUSTRIAL S-PBGA-B256 3 85 °C -40 °C 256 PLASTIC/EPOXY BGA SQUARE GRID ARRAY YES BALL BOTTOM MICROSEMI CORP 17 X 17 MM, ROHS COMPLIANT, CABGA-256 compliant 8542.39.00.01
PM4358-NGI
Microchip Technology Inc
$42.8457 Active 1.8 V CMOS FRAMER 1 INDUSTRIAL S-PBGA-B256 3 85 °C -40 °C 256 PLASTIC/EPOXY BGA SQUARE GRID ARRAY YES BALL BOTTOM MICROCHIP TECHNOLOGY INC BGA, compliant Microchip 8542.31.00.01 5A991.B