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Parametric » Telecommunication Circuits » Digital Transmission Support

Parametric results for: 米兰洲际酒店桑拿＋【719893330_Φ.扣】e... under Digital Transmission Support

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LXP2175NC
 Level One 		Check for Price No Transferred 5 V CMOS ELASTIC BUFFER 1 COMMERCIAL R-PDIP-T16 e0 Not Qualified 70 °C 16 PLASTIC/EPOXY DIP DIP16,.3 RECTANGULAR IN-LINE NO Tin/Lead (Sn/Pb) THROUGH-HOLE 2.54 mm DUAL LEVEL ONE DIP, DIP16,.3 unknown 8542.39.00.01
DS2175+
 Maxim Integrated Products 		Check for Price Yes Yes Obsolete 5 V CMOS CEPT PCM-30/E-1 2.048 Gbps ELASTIC BUFFER 1 16 µA COMMERCIAL R-PDIP-T16 e3 Not Qualified 1 70 °C 260 30 16 PLASTIC/EPOXY DIP DIP16,.3 RECTANGULAR IN-LINE NO MATTE TIN THROUGH-HOLE 2.54 mm DUAL 7.62 mm 19.175 mm 4.572 mm MAXIM INTEGRATED PRODUCTS INC 0.300 INCH, DIP-16 compliant 8473.30.11.40 DIP 16 EAR99
DS2176Q/T&R
 Maxim Integrated Products 		Check for Price No No Obsolete 5 V CMOS CEPT PCM-30/E-1 2.048 Gbps ELASTIC BUFFER T-1(DS1) 1 10 mA COMMERCIAL S-PQCC-J28 e0 Not Qualified 1 70 °C 28 PLASTIC/EPOXY QCCJ LDCC28,.5SQ SQUARE CHIP CARRIER YES TIN LEAD J BEND 1.27 mm QUAD 11.505 mm 11.505 mm 4.57 mm MAXIM INTEGRATED PRODUCTS INC PLASTIC, LCC-28 compliant 8542.39.00.01 QLCC 28
DS2176Q
 Dallas Semiconductor 		Check for Price No Transferred 5 V CMOS CEPT PCM-30/E-1 2.048 Gbps ELASTIC BUFFER T-1(DS1) 1 10 mA COMMERCIAL S-PQCC-J28 e0 Not Qualified 70 °C 28 PLASTIC/EPOXY QCCJ LDCC28,.5SQ SQUARE CHIP CARRIER YES Tin/Lead (Sn/Pb) J BEND 1.27 mm QUAD 11.5062 mm 11.5062 mm 4.57 mm DALLAS SEMICONDUCTOR PLASTIC, LCC-28 unknown
DS2176N
 Maxim Integrated Products 		Check for Price No No Obsolete 5 V CMOS CEPT PCM-30/E-1 2.048 Gbps ELASTIC BUFFER T-1(DS1) 1 10 mA INDUSTRIAL R-PDIP-T24 e0 Not Qualified 1 85 °C -40 °C 245 24 PLASTIC/EPOXY DIP DIP24,.3 RECTANGULAR IN-LINE NO TIN LEAD THROUGH-HOLE 2.54 mm DUAL 7.62 mm 30.545 mm 4.572 mm MAXIM INTEGRATED PRODUCTS INC 0.300 INCH, DIP-24 not_compliant 8542.39.00.01 DIP 24
DS2176Q+
 Maxim Integrated Products 		Check for Price Yes Yes Obsolete 5 V CMOS CEPT PCM-30/E-1 2.048 Gbps ELASTIC BUFFER 1 10 mA COMMERCIAL S-PQCC-J28 e3 Not Qualified 1 70 °C 245 28 PLASTIC/EPOXY QCCJ SQUARE CHIP CARRIER YES MATTE TIN J BEND 1.27 mm QUAD 11.5062 mm 11.5062 mm 4.57 mm MAXIM INTEGRATED PRODUCTS INC ROHS COMPLIANT, PLASTIC, LCC-28 compliant 8542.39.00.01 QLCC 28 EAR99
XR-2135ACN
 Exar Corporation 		Check for Price No No Obsolete 5 V CMOS 19 Mbps ELASTIC BUFFER 1 10 mA COMMERCIAL R-GDIP-T14 e0 Not Qualified 70 °C 14 CERAMIC, GLASS-SEALED DIP RECTANGULAR IN-LINE NO TIN LEAD THROUGH-HOLE 2.54 mm DUAL 7.62 mm 19.5453 mm 5.08 mm EXAR CORP DIP, compliant 8542.39.00.01 DIP 14
DS2175S+
 Maxim Integrated Products 		Check for Price Yes Yes Obsolete 5 V CMOS CEPT PCM-30/E-1 2.048 Gbps ELASTIC BUFFER 1 16 µA COMMERCIAL R-PDSO-G16 e3 Not Qualified 1 70 °C 260 30 16 PLASTIC/EPOXY SOP SOP16,.4 RECTANGULAR SMALL OUTLINE YES MATTE TIN GULL WING 1.27 mm DUAL 7.5 mm 10.3 mm 2.65 mm MAXIM INTEGRATED PRODUCTS INC 0.300 INCH, SOIC-16 compliant 8542.32.00.71 SOIC 16 EAR99
BT8215
 Conexant Systems Inc 		Check for Price Obsolete TELECOM CIRCUIT INDUSTRIAL Not Qualified BROOKTREE CORP QFP, unknown 8542.39.00.01 QFP 100
DS2175N
 Dallas Semiconductor 		Check for Price No Transferred 5 V CMOS ELASTIC BUFFER 1 16 mA INDUSTRIAL R-PDIP-T16 e0 Not Qualified 85 °C -40 °C 16 PLASTIC/EPOXY DIP DIP16,.3 RECTANGULAR IN-LINE NO Tin/Lead (Sn/Pb) THROUGH-HOLE 2.54 mm DUAL DALLAS SEMICONDUCTOR 0.300 INCH, DIP-16 unknown
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