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Parametric results for: M20-2.5X50MM 10.9 FTD ZC under Bus Controllers

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Manufacturer: FTDI Chip
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FT232BL
 FTDI Chip 		$0.4554 Yes Obsolete 6 MHz YES 5 V BUS CONTROLLER, UNIVERSAL SERIAL BUS CMOS 5.25 V 4.35 V COMMERCIAL S-PQFP-G32 Not Qualified e3 3 70 °C 260 30 32 PLASTIC/EPOXY LQFP QFP32,.35SQ,32 SQUARE FLATPACK, LOW PROFILE MATTE TIN GULL WING 800 µm QUAD 1.6 mm 7 mm 7 mm FUTURE TECHNOLOGY DEVICES INTERNATIONAL LTD 7 X 7 MM, 0.80 MM PITCH, ROHS COMPLIANT, LQFP-32 compliant EAR99 8542.31.00.01 FTDI Chip
FT120T-R
 FTDI Chip 		$1.6304 Yes Active VBUS 8 1 6 MHz YES 5 V BUS CONTROLLER, UNIVERSAL SERIAL BUS CMOS 5.5 V 4 V INDUSTRIAL R-PDSO-G28 Not Qualified e3 3 85 °C -40 °C 260 30 28 PLASTIC/EPOXY HTSSOP TSSOP28,.25 RECTANGULAR SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH MATTE TIN GULL WING 650 µm DUAL 1.2 mm 4.4 mm 9.7 mm FUTURE TECHNOLOGY DEVICES INTERNATIONAL LTD TSSOP-28 compliant EAR99 8542.31.00.01 FTDI Chip SOIC 28
FT4222HQ-C-R
 FTDI Chip 		$1.7400 Yes Yes Obsolete I2C; SPI; VBUS 60 MBps 12 MHz YES 3.3 V BUS CONTROLLER, UNIVERSAL SERIAL BUS CMOS ALSO OPERATES AT 5 V TYP 80 mA 3.63 V 2.97 V INDUSTRIAL S-XQCC-N32 e3 3 85 °C -40 °C 260 30 32 UNSPECIFIED HVQCCN LCC32,.2SQ,20 SQUARE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE MATTE TIN NO LEAD 500 µm QUAD 1 mm 5 mm 5 mm FUTURE TECHNOLOGY DEVICES INTERNATIONAL LTD VQFN-32 compliant 8542.31.00.01 FTDI Chip
FT4222HQ-D-R
 FTDI Chip 		$1.7428 Yes Active I2C; SPI; VBUS 60 MBps 12 MHz YES 3.3 V BUS CONTROLLER, UNIVERSAL SERIAL BUS CMOS ALSO OPERATES AT 5 V TYP 80 mA 3.63 V 2.97 V INDUSTRIAL S-XQCC-N32 85 °C -40 °C 260 40 32 UNSPECIFIED HVQCCN LCC32,.2SQ,20 SQUARE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE NO LEAD 500 µm QUAD 900 µm 5 mm 5 mm FUTURE TECHNOLOGY DEVICES INTERNATIONAL LTD VQFN-32 compliant EAR99 8542.31.00.01 FTDI Chip 2018-05-31
FT4222HQ-B-R
 FTDI Chip 		$1.7428 Yes Yes Obsolete I2C; SPI; VBUS 6.725 MBps 12 MHz YES 3.3 V BUS CONTROLLER, UNIVERSAL SERIAL BUS CMOS ALSO OPERATES AT 4.5V-5.5V SUPPLY RANGE. 3.63 V 2.97 V INDUSTRIAL S-XQCC-N32 85 °C -40 °C 32 UNSPECIFIED HVQCCN SQUARE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE NO LEAD 500 µm QUAD 1 mm 5 mm 5 mm FUTURE TECHNOLOGY DEVICES INTERNATIONAL LTD VQFN-32 compliant EAR99 8542.31.00.01 FTDI Chip
FT4222HQ-C-T
 FTDI Chip 		$1.7428 Yes Obsolete I2C; SPI; VBUS 60 MBps 12 MHz YES 3.3 V BUS CONTROLLER, UNIVERSAL SERIAL BUS CMOS ALSO OPERATES AT 5 V TYP 80 mA 3.63 V 2.97 V INDUSTRIAL S-XQCC-N32 e3 3 85 °C -40 °C 260 30 32 UNSPECIFIED HVQCCN LCC32,.2SQ,20 SQUARE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE MATTE TIN NO LEAD 500 µm QUAD 1 mm 5 mm 5 mm FUTURE TECHNOLOGY DEVICES INTERNATIONAL LTD VQFN-32 compliant 8542.31.00.01 FTDI Chip
FT234XD-R
 FTDI Chip 		$1.7447 Yes Active 60 MBps 12 MHz YES 5 V BUS CONTROLLER, UNIVERSAL SERIAL BUS CMOS 8.3 mA 5.5 V 2.97 V INDUSTRIAL S-PDSO-N12 Not Qualified 3 85 °C -40 °C 260 40 12 PLASTIC/EPOXY HTSON SOLCC12,.12,18 SQUARE SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE NO LEAD 450 µm DUAL 800 µm 3 mm 3 mm FUTURE TECHNOLOGY DEVICES INTERNATIONAL LTD DFN-12 compliant EAR99 8542.31.00.01 FTDI Chip DFN 12
FT122T-R
 FTDI Chip 		$1.7454 Yes Obsolete 8 YES 5 V BUS CONTROLLER, UNIVERSAL SERIAL BUS CMOS 5.5 V 4 V INDUSTRIAL R-PDSO-G28 85 °C -40 °C 28 PLASTIC/EPOXY TSSOP TSSOP28,.25 RECTANGULAR SMALL OUTLINE, THIN PROFILE, SHRINK PITCH GULL WING 650 µm DUAL 1.2 mm 4.4 mm 9.7 mm FUTURE TECHNOLOGY DEVICES INTERNATIONAL LTD TSSOP, TSSOP28,.25 compliant 8542.31.00.01 FTDI Chip
FT120T-U
 FTDI Chip 		$1.7554 Yes Active VBUS 8 1 6 MHz YES 5 V BUS CONTROLLER, UNIVERSAL SERIAL BUS CMOS 5.5 V 4 V INDUSTRIAL R-PDSO-G28 Not Qualified e3 3 85 °C -40 °C 260 30 28 PLASTIC/EPOXY HTSSOP TSSOP28,.25 RECTANGULAR SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH MATTE TIN GULL WING 650 µm DUAL 1.2 mm 4.4 mm 9.7 mm FUTURE TECHNOLOGY DEVICES INTERNATIONAL LTD TSSOP-28 compliant 8542.31.00.01 FTDI Chip SOIC 28
FT234XD-T
 FTDI Chip 		$1.7838 Yes Active 60 MBps 12 MHz YES 5 V BUS CONTROLLER, UNIVERSAL SERIAL BUS CMOS 8.3 mA 5.5 V 2.97 V INDUSTRIAL S-PDSO-N12 Not Qualified 85 °C -40 °C NOT SPECIFIED NOT SPECIFIED 12 PLASTIC/EPOXY HTSON SOLCC12,.12,18 SQUARE SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE NO LEAD 450 µm DUAL 800 µm 3 mm 3 mm FUTURE TECHNOLOGY DEVICES INTERNATIONAL LTD 3 X 3 MM, ROHS COMPLIANT, DFN-12 compliant 8542.31.00.01 FTDI Chip DFN 12
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