Parametric results for: Digital Transmission Support

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T5691IP
Exar Corporation
Check for Price No Obsolete 5 V CMOS CEPT PCM-30/E-1 2.048 Gbps ELASTIC BUFFER T-1(DS1) 1 10 mA INDUSTRIAL R-PDIP-T24 e0 Not Qualified 85 °C -40 °C 24 PLASTIC/EPOXY DIP DIP24,.3 RECTANGULAR IN-LINE NO TIN LEAD THROUGH-HOLE 2.54 mm DUAL EXAR CORP DIP DIP, DIP24,.3 24 unknown 8542.39.00.01
LXP2176PE
Level One
Check for Price No Transferred 5 V CMOS CEPT PCM-30/E-1 2.048 Gbps ELASTIC BUFFER T-1(DS1) 1 10 mA INDUSTRIAL S-PQCC-J28 e0 Not Qualified 85 °C -40 °C 28 PLASTIC/EPOXY QCCJ LDCC28,.5SQ SQUARE CHIP CARRIER YES Tin/Lead (Sn/Pb) J BEND 1.27 mm QUAD LEVEL ONE QCCJ, LDCC28,.5SQ unknown 8542.39.00.01
DS2175
Maxim Integrated Products
Check for Price No Obsolete 5 V CMOS CEPT PCM-30/E-1 2.048 Gbps ELASTIC BUFFER 1 16 µA COMMERCIAL R-PDIP-T16 e0 Not Qualified 1 70 °C 16 PLASTIC/EPOXY DIP DIP16,.3 RECTANGULAR IN-LINE NO TIN LEAD THROUGH-HOLE 2.54 mm DUAL 7.62 mm 19.175 mm 4.572 mm MAXIM INTEGRATED PRODUCTS INC 0.300 INCH, DIP-16 compliant
DS2176N
Dallas Semiconductor
Check for Price No Transferred 5 V CMOS CEPT PCM-30/E-1 2.048 Gbps ELASTIC BUFFER T-1(DS1) 1 10 mA INDUSTRIAL R-PDIP-T24 e0 Not Qualified 85 °C -40 °C 24 PLASTIC/EPOXY DIP DIP24,.3 RECTANGULAR IN-LINE NO Tin/Lead (Sn/Pb) THROUGH-HOLE 2.54 mm DUAL 7.62 mm 31.877 mm 4.699 mm DALLAS SEMICONDUCTOR 0.300 INCH, DIP-24 unknown
DS2176QN
Maxim Integrated Products
Check for Price No No Obsolete 5 V CMOS CEPT PCM-30/E-1 2.048 Gbps ELASTIC BUFFER T-1(DS1) 1 10 mA INDUSTRIAL S-PQCC-J28 e0 Not Qualified 1 85 °C -40 °C 28 PLASTIC/EPOXY QCCJ LDCC28,.5SQ SQUARE CHIP CARRIER YES TIN LEAD J BEND 1.27 mm QUAD 11.505 mm 11.505 mm 4.57 mm MAXIM INTEGRATED PRODUCTS INC QLCC PLASTIC, LCC-28 28 compliant 8542.39.00.01 EAR99
DS2175SN
Dallas Semiconductor
Check for Price No Transferred 5 V CMOS ELASTIC BUFFER 1 16 µA INDUSTRIAL R-PDSO-G16 e0 Not Qualified 85 °C -40 °C 16 PLASTIC/EPOXY SOP SOP16,.4 RECTANGULAR SMALL OUTLINE YES Tin/Lead (Sn/Pb) GULL WING 1.27 mm DUAL 7.5 mm 10.3 mm 2.65 mm DALLAS SEMICONDUCTOR 0.300 INCH, SOIC-16 unknown
LXP2175SE
Intel Corporation
Check for Price No No Obsolete 5 V CMOS CEPT PCM-30/E-1 2.048 Gbps ELASTIC BUFFER 1 INDUSTRIAL R-PDSO-G16 e0 Not Qualified 85 °C -40 °C 16 PLASTIC/EPOXY SOP SOP16,.4 RECTANGULAR SMALL OUTLINE YES TIN LEAD GULL WING 1.27 mm DUAL 7.5 mm 10.3 mm 2.65 mm INTEL CORP SOIC SOP, SOP16,.4 16 compliant 8542.39.00.01
DS2175S+T&R
Maxim Integrated Products
Check for Price Yes Yes Obsolete 5 V CMOS CEPT PCM-30/E-1 2.048 Gbps ELASTIC BUFFER 1 16 µA COMMERCIAL R-PDSO-G16 e3 Not Qualified 1 70 °C 260 30 16 PLASTIC/EPOXY SOP SOP16,.4 RECTANGULAR SMALL OUTLINE YES MATTE TIN GULL WING 1.27 mm DUAL 7.5 mm 10.3 mm 2.65 mm MAXIM INTEGRATED PRODUCTS INC SOIC 0.300 INCH, SOIC-16 16 compliant 8542.32.00.71 EAR99
LXP2175NC
Intel Corporation
Check for Price No No Obsolete 5 V CMOS CEPT PCM-30/E-1 2.048 Gbps ELASTIC BUFFER 1 COMMERCIAL R-PDIP-T16 e0 Not Qualified 70 °C 16 PLASTIC/EPOXY DIP DIP16,.3 RECTANGULAR IN-LINE NO TIN LEAD THROUGH-HOLE 2.54 mm DUAL 7.62 mm 5.84 mm INTEL CORP DIP DIP, DIP16,.3 16 compliant 8542.39.00.01
DS2175+
Maxim Integrated Products
Check for Price Yes Yes Obsolete 5 V CMOS CEPT PCM-30/E-1 2.048 Gbps ELASTIC BUFFER 1 16 µA COMMERCIAL R-PDIP-T16 e3 Not Qualified 1 70 °C 260 30 16 PLASTIC/EPOXY DIP DIP16,.3 RECTANGULAR IN-LINE NO MATTE TIN THROUGH-HOLE 2.54 mm DUAL 7.62 mm 19.175 mm 4.572 mm MAXIM INTEGRATED PRODUCTS INC DIP 0.300 INCH, DIP-16 16 compliant 8473.30.11.40 EAR99