1000BM2 vs TH8050 feature comparison

1000BM2 LSI Corporation

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TH8050 Melexis Microelectronic Integrated Systems

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer AT & T MICROELECTRONICS THESYS GESELLSCHAFT FUR MIKROELEKTRONIK MBH
Package Description , SOP,
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code S-PQCC-J44 R-PDSO-G8
Number of Functions 1 1
Number of Terminals 44 8
Operating Temperature-Max 70 °C 125 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Shape SQUARE RECTANGULAR
Package Style CHIP CARRIER SMALL OUTLINE
Qualification Status Not Qualified Not Qualified
Supply Voltage-Nom 5 V 5 V
Surface Mount YES YES
Telecom IC Type INTERFACE CIRCUIT INTERFACE CIRCUIT
Temperature Grade COMMERCIAL AUTOMOTIVE
Terminal Form J BEND GULL WING
Terminal Position QUAD DUAL
Base Number Matches 1 1
Length 4.9 mm
Package Code SOP
Seated Height-Max 1.75 mm
Terminal Pitch 1.27 mm
Width 3.9 mm

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