1000BM2
vs
TJA1050T/CM,112
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
AT & T MICROELECTRONICS
|
NXP SEMICONDUCTORS
|
| Package Description |
,
|
SOP,
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| JESD-30 Code |
S-PQCC-J44
|
R-PDSO-G8
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
44
|
8
|
| Operating Temperature-Max |
70 °C
|
|
| Operating Temperature-Min |
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER
|
SMALL OUTLINE
|
| Qualification Status |
Not Qualified
|
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Telecom IC Type |
INTERFACE CIRCUIT
|
INTERFACE CIRCUIT
|
| Temperature Grade |
COMMERCIAL
|
|
| Terminal Form |
J BEND
|
GULL WING
|
| Terminal Position |
QUAD
|
DUAL
|
| Base Number Matches |
1
|
1
|
| Part Package Code |
|
SOIC
|
| Pin Count |
|
8
|
| Length |
|
4.9 mm
|
| Package Code |
|
SOP
|
| Seated Height-Max |
|
1.75 mm
|
| Terminal Pitch |
|
1.27 mm
|
| Width |
|
3.9 mm
|
|
|
|
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