1000BM2 vs TLE6251DS feature comparison

1000BM2 LSI Corporation

Buy Now Datasheet

TLE6251DS Infineon Technologies AG

Buy Now Datasheet
Part Life Cycle Code Obsolete Not Recommended
Ihs Manufacturer AT & T MICROELECTRONICS INFINEON TECHNOLOGIES AG
Package Description , PLASTIC, SO-8
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code S-PQCC-J44 R-PDSO-G8
Number of Functions 1 1
Number of Terminals 44 8
Operating Temperature-Max 70 °C
Operating Temperature-Min
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Shape SQUARE RECTANGULAR
Package Style CHIP CARRIER SMALL OUTLINE
Qualification Status Not Qualified Not Qualified
Supply Voltage-Nom 5 V 5 V
Surface Mount YES YES
Telecom IC Type INTERFACE CIRCUIT INTERFACE CIRCUIT
Temperature Grade COMMERCIAL
Terminal Form J BEND GULL WING
Terminal Position QUAD DUAL
Base Number Matches 1 1
Pbfree Code Yes
Rohs Code Yes
Part Package Code SOIC
Pin Count 8
Samacsys Manufacturer Infineon
Data Rate 1000 Mbps
Length 5 mm
Moisture Sensitivity Level 2A
Number of Transceivers 1
Package Code SOP
Package Equivalence Code SOP8,.25
Peak Reflow Temperature (Cel) 260
Screening Level AEC-Q100
Seated Height-Max 1.75 mm
Supply Current-Max 0.07 mA
Terminal Finish Nickel/Gold/Palladium (Ni/Au/Pd)
Terminal Pitch 1.27 mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 4.4 mm

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