100164DCQR
vs
100363FM
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
NATIONAL SEMICONDUCTOR CORP
|
NATIONAL SEMICONDUCTOR CORP
|
| Package Description |
DIP, DIP24,.4
|
QFF, QFL24,.4SQ
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Family |
100K
|
100K
|
| JESD-30 Code |
R-GDIP-T24
|
S-GQFP-F24
|
| JESD-609 Code |
e0
|
e0
|
| Logic IC Type |
MULTIPLEXER
|
MULTIPLEXER
|
| Number of Functions |
1
|
2
|
| Number of Inputs |
16
|
8
|
| Number of Outputs |
1
|
1
|
| Number of Terminals |
24
|
24
|
| Operating Temperature-Max |
85 °C
|
125 °C
|
| Operating Temperature-Min |
|
-55 °C
|
| Output Characteristics |
OPEN-EMITTER
|
OPEN-EMITTER
|
| Output Polarity |
TRUE
|
TRUE
|
| Package Body Material |
CERAMIC, GLASS-SEALED
|
CERAMIC, GLASS-SEALED
|
| Package Code |
DIP
|
QFF
|
| Package Equivalence Code |
DIP24,.4
|
QFL24,.4SQ
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
IN-LINE
|
FLATPACK
|
| Power Supply Current-Max (ICC) |
105 mA
|
87 mA
|
| Prop. Delay@Nom-Sup |
2.55 ns
|
3 ns
|
| Propagation Delay (tpd) |
3.6 ns
|
3.4 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
5.72 mm
|
2.159 mm
|
| Surface Mount |
NO
|
YES
|
| Technology |
ECL
|
ECL
|
| Temperature Grade |
OTHER
|
MILITARY
|
| Terminal Finish |
TIN LEAD
|
TIN LEAD
|
| Terminal Form |
THROUGH-HOLE
|
FLAT
|
| Terminal Pitch |
2.54 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
QUAD
|
| Width |
10.16 mm
|
9.398 mm
|
| Base Number Matches |
1
|
3
|
| Length |
|
9.398 mm
|
|
|
|
Compare 100164DCQR with alternatives
Compare 100363FM with alternatives