100302W-QMLV
vs
5962-9152802MYX
feature comparison
Rohs Code |
No
|
|
Part Life Cycle Code |
Obsolete
|
Active
|
Ihs Manufacturer |
NATIONAL SEMICONDUCTOR CORP
|
TELEDYNE E2V (UK) LTD
|
Package Description |
QFF, QFL24,.4SQ
|
QFF,
|
Reach Compliance Code |
compliant
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Family |
100K
|
100K
|
JESD-30 Code |
S-GQFP-F24
|
S-GQFP-F24
|
JESD-609 Code |
e0
|
|
Logic IC Type |
OR/NOR GATE
|
OR/NOR GATE
|
Moisture Sensitivity Level |
1
|
|
Number of Functions |
5
|
5
|
Number of Inputs |
2
|
2
|
Number of Terminals |
24
|
24
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-55 °C
|
-55 °C
|
Package Body Material |
CERAMIC, GLASS-SEALED
|
CERAMIC, GLASS-SEALED
|
Package Code |
QFF
|
QFF
|
Package Equivalence Code |
QFL24,.4SQ
|
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
FLATPACK
|
FLATPACK
|
Peak Reflow Temperature (Cel) |
260
|
|
Power Supply Current-Max (ICC) |
48 mA
|
|
Prop. Delay@Nom-Sup |
1.7 ns
|
|
Propagation Delay (tpd) |
1.5 ns
|
1.5 ns
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Schmitt Trigger |
NO
|
|
Screening Level |
MIL-PRF-38535 Class V
|
MIL-STD-883
|
Seated Height-Max |
2.159 mm
|
2.159 mm
|
Surface Mount |
YES
|
YES
|
Technology |
ECL
|
ECL
|
Temperature Grade |
MILITARY
|
MILITARY
|
Terminal Finish |
Tin/Lead (Sn63Pb37)
|
|
Terminal Form |
FLAT
|
FLAT
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
QUAD
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
40
|
|
Base Number Matches |
4
|
3
|
Part Package Code |
|
QFP
|
Pin Count |
|
24
|
Supply Voltage-Max (Vsup) |
|
-5.46 V
|
Supply Voltage-Min (Vsup) |
|
-4.94 V
|
Supply Voltage-Nom (Vsup) |
|
-5.2 V
|
|
|
|
Compare 100302W-QMLV with alternatives
Compare 5962-9152802MYX with alternatives