100323PC
vs
100323DM
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
NATIONAL SEMICONDUCTOR CORP
|
NATIONAL SEMICONDUCTOR CORP
|
| Part Package Code |
DIP
|
|
| Package Description |
DIP, DIP24,.4
|
DIP, DIP24,.4
|
| Pin Count |
24
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Additional Feature |
25 OHM LINE DRIVE CAPABILITY; COMMON OUTPUT ENABLE
|
WITH 25 OHM LINE DRIVE CAPABILITY
|
| Control Type |
ENABLE HIGH
|
ENABLE HIGH
|
| Family |
100K
|
100K
|
| JESD-30 Code |
R-PDIP-T24
|
R-GDIP-T24
|
| JESD-609 Code |
e0
|
e0
|
| Length |
30.585 mm
|
|
| Load Capacitance (CL) |
3 pF
|
3 pF
|
| Logic IC Type |
BUS DRIVER
|
BUS DRIVER
|
| Number of Bits |
2
|
2
|
| Number of Functions |
3
|
3
|
| Number of Ports |
2
|
2
|
| Number of Terminals |
24
|
24
|
| Operating Temperature-Max |
85 °C
|
125 °C
|
| Operating Temperature-Min |
|
-55 °C
|
| Output Characteristics |
OPEN-EMITTER WITH CUT-OFF
|
OPEN-EMITTER WITH CUT-OFF
|
| Output Polarity |
TRUE
|
TRUE
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, GLASS-SEALED
|
| Package Code |
DIP
|
DIP
|
| Package Equivalence Code |
DIP24,.4
|
DIP24,.4
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Power Supply Current-Max (ICC) |
121 mA
|
150 mA
|
| Prop. Delay@Nom-Sup |
3.8 ns
|
4.2 ns
|
| Propagation Delay (tpd) |
2.7 ns
|
3.6 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
5.08 mm
|
5.72 mm
|
| Surface Mount |
NO
|
NO
|
| Technology |
ECL
|
ECL
|
| Temperature Grade |
OTHER
|
MILITARY
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
TIN LEAD
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
10.16 mm
|
10.16 mm
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare 100323PC with alternatives
Compare 100323DM with alternatives