100325FMQB
vs
5962-9153101MYX
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
NATIONAL SEMICONDUCTOR CORP
|
QP SEMICONDUCTOR INC
|
| Package Description |
QFF, QFL24,.4SQ
|
QFF,
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Delay-Max |
5.7 ns
|
4.7 ns
|
| Input Characteristics |
DIFFERENTIAL
|
|
| Interface IC Type |
ECL TO TTL TRANSLATOR
|
ECL TO TTL TRANSLATOR
|
| JESD-30 Code |
S-GQFP-F24
|
R-GQFP-F24
|
| JESD-609 Code |
e0
|
|
| Length |
9.398 mm
|
9.398 mm
|
| Number of Bits |
1
|
1
|
| Number of Functions |
6
|
6
|
| Number of Terminals |
24
|
24
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Output Characteristics |
TOTEM-POLE
|
3-STATE
|
| Output Latch or Register |
NONE
|
NONE
|
| Output Polarity |
TRUE
|
TRUE
|
| Package Body Material |
CERAMIC, GLASS-SEALED
|
CERAMIC, GLASS-SEALED
|
| Package Code |
QFF
|
QFF
|
| Package Equivalence Code |
QFL24,.4SQ
|
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
FLATPACK
|
FLATPACK
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Screening Level |
MIL-STD-883
|
MIL-STD-883
|
| Seated Height-Max |
2.159 mm
|
2.159 mm
|
| Surface Mount |
YES
|
YES
|
| Technology |
BIPOLAR
|
ECL
|
| Temperature Grade |
MILITARY
|
MILITARY
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
FLAT
|
FLAT
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
9.398 mm
|
9.398 mm
|
| Base Number Matches |
1
|
1
|
| Part Package Code |
|
QFP
|
| Pin Count |
|
24
|
| Supply Voltage-Max |
|
5.5 V
|
| Supply Voltage-Min |
|
4.5 V
|
| Supply Voltage-Nom |
|
5 V
|
|
|
|
Compare 100325FMQB with alternatives
Compare 5962-9153101MYX with alternatives