100325J-QMLV
vs
100325MW8
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
NATIONAL SEMICONDUCTOR CORP
|
NATIONAL SEMICONDUCTOR CORP
|
| Package Description |
0.400 INCH, CERDIP-24
|
DIE,
|
| Reach Compliance Code |
not_compliant
|
unknown
|
| Delay-Max |
5.7 ns
|
4.7 ns
|
| Interface IC Type |
ECL TO TTL TRANSLATOR
|
ECL TO TTL TRANSLATOR
|
| JESD-30 Code |
R-GDIP-T24
|
X-XUUC-N
|
| JESD-609 Code |
e0
|
|
| Moisture Sensitivity Level |
1
|
|
| Number of Bits |
1
|
1
|
| Number of Functions |
6
|
6
|
| Number of Terminals |
24
|
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Output Latch or Register |
NONE
|
NONE
|
| Output Polarity |
COMPLEMENTARY
|
TRUE
|
| Package Body Material |
CERAMIC, GLASS-SEALED
|
UNSPECIFIED
|
| Package Code |
DIP
|
DIE
|
| Package Equivalence Code |
DIP24,.4
|
|
| Package Shape |
RECTANGULAR
|
UNSPECIFIED
|
| Package Style |
IN-LINE
|
UNCASED CHIP
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Screening Level |
MIL-STD-883
|
|
| Seated Height-Max |
5.72 mm
|
|
| Supply Voltage-Max |
5.5 V
|
5.5 V
|
| Supply Voltage-Min |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
NO
|
YES
|
| Technology |
ECL
|
ECL
|
| Temperature Grade |
MILITARY
|
MILITARY
|
| Terminal Finish |
Tin/Lead (Sn63Pb37)
|
|
| Terminal Form |
THROUGH-HOLE
|
NO LEAD
|
| Terminal Pitch |
2.54 mm
|
|
| Terminal Position |
DUAL
|
UPPER
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
|
| Width |
10.16 mm
|
|
| Base Number Matches |
1
|
1
|
| Part Package Code |
|
WAFER
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8542.39.00.01
|
| Output Characteristics |
|
3-STATE
|
|
|
|
Compare 100325J-QMLV with alternatives
Compare 100325MW8 with alternatives