100360DMQB
vs
SY100S366JZ-TR
feature comparison
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
NATIONAL SEMICONDUCTOR CORP
|
MICROCHIP TECHNOLOGY INC
|
| Package Description |
DIP, DIP24,.4
|
LEAD FREE, PLASTIC, LCC-28
|
| Reach Compliance Code |
unknown
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Additional Feature |
EVEN PARITY GENERATOR
|
|
| Family |
100K
|
100S
|
| JESD-30 Code |
R-GDIP-T24
|
S-PQCC-J28
|
| JESD-609 Code |
e0
|
e3
|
| Load Capacitance (CL) |
3 pF
|
|
| Logic IC Type |
PARITY GENERATOR/CHECKER
|
MAGNITUDE COMPARATOR
|
| Number of Bits |
9
|
9
|
| Number of Functions |
2
|
1
|
| Number of Terminals |
24
|
28
|
| Operating Temperature-Max |
125 °C
|
85 °C
|
| Operating Temperature-Min |
-55 °C
|
|
| Output Characteristics |
OPEN-EMITTER
|
OPEN-EMITTER
|
| Output Polarity |
TRUE
|
TRUE
|
| Package Body Material |
CERAMIC, GLASS-SEALED
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
QCCJ
|
| Package Equivalence Code |
DIP24,.4
|
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
IN-LINE
|
CHIP CARRIER
|
| Power Supply Current-Max (ICC) |
110 mA
|
|
| Propagation Delay (tpd) |
2.95 ns
|
1.5 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Screening Level |
38535Q/M;38534H;883B
|
|
| Seated Height-Max |
5.715 mm
|
4.57 mm
|
| Surface Mount |
NO
|
YES
|
| Technology |
ECL
|
|
| Temperature Grade |
MILITARY
|
COMMERCIAL EXTENDED
|
| Terminal Finish |
TIN LEAD
|
MATTE TIN
|
| Terminal Form |
THROUGH-HOLE
|
J BEND
|
| Terminal Pitch |
2.54 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
QUAD
|
| Width |
10.16 mm
|
11.48 mm
|
| Base Number Matches |
3
|
1
|
| Length |
|
11.48 mm
|
| Moisture Sensitivity Level |
|
2
|
| Packing Method |
|
TR
|
|
|
|
Compare 100360DMQB with alternatives
Compare SY100S366JZ-TR with alternatives