10117D
vs
FMM364HG
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
FUJITSU LTD
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| JESD-30 Code |
R-PDSO-G16
|
R-PDFP-F14
|
| JESD-609 Code |
e0
|
|
| Logic IC Type |
OR-AND/OR-AND-INVERT GATE
|
OR/NOR GATE
|
| Number of Terminals |
16
|
14
|
| Operating Temperature-Max |
85 °C
|
|
| Operating Temperature-Min |
-30 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
DFP
|
| Package Equivalence Code |
SOP16,.25
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
FLATPACK
|
| Power Supply Current-Max (ICC) |
29 mA
|
|
| Prop. Delay@Nom-Sup |
3.9 ns
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Schmitt Trigger |
NO
|
|
| Surface Mount |
YES
|
YES
|
| Technology |
ECL10K
|
|
| Temperature Grade |
OTHER
|
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
|
| Terminal Form |
GULL WING
|
FLAT
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Base Number Matches |
4
|
2
|
| Part Package Code |
|
DFP
|
| Package Description |
|
DFP,
|
| Pin Count |
|
14
|
| Family |
|
MM
|
| Length |
|
10 mm
|
| Number of Functions |
|
1
|
| Number of Inputs |
|
2
|
| Seated Height-Max |
|
1.6 mm
|
| Width |
|
5.6 mm
|
|
|
|
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