10M04SAM153C8G
vs
10M04SAM153C8P
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
INTEL CORP
|
INTEL CORP
|
| Package Description |
8 X 8 MM, 0.50 MM PITCH, ROHS COMPLIANT, MBGA-153
|
MBGA-153
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Samacsys Manufacturer |
Intel
|
|
| Additional Feature |
ALSO OPERATES AT 3.3 V NOMINAL SUPPLY
|
ALSO OPERATES AT 3.3 V NOMINAL SUPPLY
|
| JESD-30 Code |
S-PBGA-B153
|
S-PBGA-B153
|
| Length |
8 mm
|
8 mm
|
| Moisture Sensitivity Level |
3
|
|
| Number of CLBs |
250
|
250
|
| Number of Inputs |
246
|
246
|
| Number of Logic Cells |
4000
|
4000
|
| Number of Outputs |
246
|
246
|
| Number of Terminals |
153
|
153
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
|
|
| Organization |
250 CLBS
|
250 CLBS
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
BGA
|
VFBGA
|
| Package Equivalence Code |
BGA153,15X15,20
|
BGA153,15X15,20
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
NOT SPECIFIED
|
| Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
| Seated Height-Max |
1 mm
|
1 mm
|
| Supply Voltage-Max |
3.15 V
|
3.15 V
|
| Supply Voltage-Min |
2.85 V
|
2.85 V
|
| Supply Voltage-Nom |
3 V
|
3 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
OTHER
|
COMMERCIAL EXTENDED
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
NOT SPECIFIED
|
| Width |
8 mm
|
8 mm
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare 10M04SAM153C8G with alternatives
Compare 10M04SAM153C8P with alternatives