10M50DAF256C7G
vs
10M50DAF256I7P
feature comparison
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Transferred
|
Active
|
Ihs Manufacturer |
ALTERA CORP
|
INTEL CORP
|
Package Description |
BGA, BGA256,16X16,40
|
FBGA-256
|
Reach Compliance Code |
compliant
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Samacsys Manufacturer |
Intel
|
|
JESD-30 Code |
S-PBGA-B256
|
S-PBGA-B256
|
JESD-609 Code |
e1
|
|
Moisture Sensitivity Level |
3
|
|
Number of Inputs |
178
|
500
|
Number of Logic Cells |
50000
|
50000
|
Number of Outputs |
178
|
500
|
Number of Terminals |
256
|
256
|
Operating Temperature-Max |
85 °C
|
100 °C
|
Operating Temperature-Min |
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
BGA
|
LBGA
|
Package Equivalence Code |
BGA256,16X16,40
|
BGA256,16X16,40
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY
|
GRID ARRAY, LOW PROFILE
|
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
Qualification Status |
Not Qualified
|
|
Supply Voltage-Nom |
1.2 V
|
1.2 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
|
Temperature Grade |
OTHER
|
INDUSTRIAL
|
Terminal Finish |
TIN SILVER COPPER
|
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1 mm
|
1 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Base Number Matches |
2
|
1
|
Length |
|
17 mm
|
Number of CLBs |
|
3125
|
Organization |
|
3125 CLBS
|
Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
Seated Height-Max |
|
1.55 mm
|
Supply Voltage-Max |
|
1.25 V
|
Supply Voltage-Min |
|
1.15 V
|
Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
Width |
|
17 mm
|
|
|
|
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