12509/BEAJC
vs
MC12026ADR2G
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
MOTOROLA SEMICONDUCTOR PRODUCTS
|
ROCHESTER ELECTRONICS LLC
|
| Package Description |
DIP, DIP16,.3
|
LEAD FREE, SOIC-8
|
| Reach Compliance Code |
unknown
|
unknown
|
| JESD-30 Code |
R-XDIP-T16
|
R-PDSO-G8
|
| JESD-609 Code |
e0
|
e3
|
| Logic IC Type |
PRESCALER
|
PRESCALER
|
| Max Frequency@Nom-Sup |
420000000 Hz
|
|
| Number of Terminals |
16
|
8
|
| Operating Temperature-Max |
125 °C
|
85 °C
|
| Operating Temperature-Min |
-55 °C
|
-40 °C
|
| Package Body Material |
CERAMIC
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
SOP
|
| Package Equivalence Code |
DIP16,.3
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
SMALL OUTLINE
|
| Power Supplies |
5,-5.2 V
|
|
| Qualification Status |
Not Qualified
|
COMMERCIAL
|
| Screening Level |
38535Q/M;38534H;883B
|
|
| Surface Mount |
NO
|
YES
|
| Technology |
ECL
|
|
| Temperature Grade |
MILITARY
|
INDUSTRIAL
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
MATTE TIN
|
| Terminal Form |
THROUGH-HOLE
|
GULL WING
|
| Terminal Pitch |
2.54 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Base Number Matches |
3
|
2
|
| Pbfree Code |
|
No
|
| Part Package Code |
|
SOIC
|
| Pin Count |
|
8
|
| Additional Feature |
|
SELECTABLE DIVISION RATIO 16/17
|
| Family |
|
ECL
|
| Length |
|
4.9 mm
|
| Moisture Sensitivity Level |
|
NOT SPECIFIED
|
| Number of Data/Clock Inputs |
|
1
|
| Number of Functions |
|
1
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Seated Height-Max |
|
1.75 mm
|
| Supply Voltage-Max (Vsup) |
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
|
5 V
|
| Time@Peak Reflow Temperature-Max (s) |
|
40
|
| Width |
|
3.9 mm
|
| fmax-Min |
|
1100 MHz
|
|
|
|