1N4990
vs
JANTXV1N4990
feature comparison
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
MICROSS COMPONENTS
|
MICROCHIP TECHNOLOGY INC
|
Package Description |
HERMETIC SEALED PACKAGE-2
|
HERMETIC SEALED, GLASS PACKAGE-2
|
Reach Compliance Code |
compliant
|
compliant
|
Factory Lead Time |
27 Weeks
|
28 Weeks
|
Additional Feature |
LOW IMPEDANCE
|
|
Case Connection |
ISOLATED
|
ISOLATED
|
Configuration |
SINGLE
|
SINGLE
|
Diode Element Material |
SILICON
|
SILICON
|
Diode Type |
ZENER DIODE
|
ZENER DIODE
|
Dynamic Impedance-Max |
550 Ω
|
|
JESD-30 Code |
O-XALF-W2
|
O-LALF-W2
|
Number of Elements |
1
|
1
|
Number of Terminals |
2
|
2
|
Operating Temperature-Max |
175 °C
|
|
Package Body Material |
UNSPECIFIED
|
GLASS
|
Package Shape |
ROUND
|
ROUND
|
Package Style |
LONG FORM
|
LONG FORM
|
Polarity |
UNIDIRECTIONAL
|
UNIDIRECTIONAL
|
Power Dissipation-Max |
5 W
|
5 W
|
Qualification Status |
Not Qualified
|
Qualified
|
Reference Voltage-Nom |
220 V
|
220 V
|
Surface Mount |
NO
|
NO
|
Technology |
ZENER
|
ZENER
|
Terminal Form |
WIRE
|
WIRE
|
Terminal Position |
AXIAL
|
AXIAL
|
Voltage Tol-Max |
5%
|
5%
|
Working Test Current |
5 mA
|
5 mA
|
Base Number Matches |
10
|
8
|
JESD-609 Code |
|
e0
|
Reference Standard |
|
MIL-19500/356H
|
Terminal Finish |
|
Tin/Lead (Sn/Pb)
|
|
|
|
Compare 1N4990 with alternatives
Compare JANTXV1N4990 with alternatives