1N5221BUR-1
vs
TZM5223B-GS08
feature comparison
Rohs Code |
No
|
Yes
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
VISHAY INTERTECHNOLOGY INC
|
Package Description |
HERMETIC SEALED, GLASS, MLL34, MELF-2
|
MELF-2
|
Reach Compliance Code |
compliant
|
compliant
|
Factory Lead Time |
14 Weeks
|
9 Weeks
|
Samacsys Manufacturer |
Microchip
|
Vishay
|
Case Connection |
ISOLATED
|
ISOLATED
|
Configuration |
SINGLE
|
SINGLE
|
Diode Element Material |
SILICON
|
SILICON
|
Diode Type |
ZENER DIODE
|
ZENER DIODE
|
JEDEC-95 Code |
DO-213AA
|
DO-213AA
|
JESD-30 Code |
O-LELF-R2
|
O-LELF-R2
|
JESD-609 Code |
e0
|
e2
|
Moisture Sensitivity Level |
1
|
1
|
Number of Elements |
1
|
1
|
Number of Terminals |
2
|
2
|
Operating Temperature-Max |
175 °C
|
175 °C
|
Operating Temperature-Min |
-65 °C
|
|
Package Body Material |
GLASS
|
GLASS
|
Package Shape |
ROUND
|
ROUND
|
Package Style |
LONG FORM
|
LONG FORM
|
Polarity |
UNIDIRECTIONAL
|
UNIDIRECTIONAL
|
Power Dissipation-Max |
0.5 W
|
0.5 W
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Reference Voltage-Nom |
2.4 V
|
2.7 V
|
Surface Mount |
YES
|
YES
|
Technology |
ZENER
|
ZENER
|
Terminal Finish |
TIN LEAD
|
TIN SILVER
|
Terminal Form |
WRAP AROUND
|
WRAP AROUND
|
Terminal Position |
END
|
END
|
Voltage Tol-Max |
5%
|
5%
|
Working Test Current |
20 mA
|
20 mA
|
Base Number Matches |
1
|
1
|
Dynamic Impedance-Max |
|
30 Ω
|
Peak Reflow Temperature (Cel) |
|
260
|
Reference Standard |
|
AEC-Q101
|
Time@Peak Reflow Temperature-Max (s) |
|
10
|
|
|
|
Compare 1N5221BUR-1 with alternatives
Compare TZM5223B-GS08 with alternatives