1N5617
vs
JAN1N5617
feature comparison
Part Life Cycle Code |
Obsolete
|
Active
|
Ihs Manufacturer |
GENERAL INSTRUMENT CORP
|
MICROSS COMPONENTS
|
Package Description |
HERMETIC SEALED, GLASS PACKAGE-2
|
|
Reach Compliance Code |
unknown
|
unknown
|
Additional Feature |
PATENTED DEVICE
|
|
Case Connection |
ISOLATED
|
ISOLATED
|
Configuration |
SINGLE
|
SINGLE
|
Diode Element Material |
SILICON
|
SILICON
|
Diode Type |
RECTIFIER DIODE
|
RECTIFIER DIODE
|
JEDEC-95 Code |
DO-204AP
|
DO-7
|
JESD-30 Code |
E-LALF-W2
|
E-XALF-W2
|
Number of Elements |
1
|
1
|
Number of Terminals |
2
|
2
|
Operating Temperature-Max |
175 °C
|
175 °C
|
Operating Temperature-Min |
-65 °C
|
-65 °C
|
Output Current-Max |
1 A
|
1 A
|
Package Body Material |
GLASS
|
UNSPECIFIED
|
Package Shape |
ELLIPTICAL
|
ELLIPTICAL
|
Package Style |
LONG FORM
|
LONG FORM
|
Qualification Status |
Not Qualified
|
Qualified
|
Rep Pk Reverse Voltage-Max |
400 V
|
400 V
|
Reverse Recovery Time-Max |
0.15 µs
|
0.15 µs
|
Surface Mount |
NO
|
NO
|
Terminal Form |
WIRE
|
WIRE
|
Terminal Position |
AXIAL
|
AXIAL
|
Base Number Matches |
4
|
1
|
Factory Lead Time |
|
29 Weeks
|
Application |
|
GENERAL PURPOSE
|
Forward Voltage-Max (VF) |
|
1.2 V
|
Non-rep Pk Forward Current-Max |
|
50 A
|
Number of Phases |
|
1
|
Reference Standard |
|
MIL-19500
|
|
|
|
Compare 1N5617 with alternatives
Compare JAN1N5617 with alternatives