1SMB24AT3
vs
TPSMB24A
feature comparison
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
MOTOROLA SEMICONDUCTOR PRODUCTS
|
MERITEK ELECTRONICS CORP
|
| Reach Compliance Code |
unknown
|
unknown
|
| Clamping Voltage-Max |
38.9 V
|
33.2 V
|
| Diode Type |
TRANS VOLTAGE SUPPRESSOR DIODE
|
TRANS VOLTAGE SUPPRESSOR DIODE
|
| JESD-609 Code |
e0
|
|
| Polarity |
UNIDIRECTIONAL
|
UNIDIRECTIONAL
|
| Rep Pk Reverse Voltage-Max |
24 V
|
20.5 V
|
| Surface Mount |
YES
|
YES
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
|
| Base Number Matches |
4
|
6
|
| Package Description |
|
SMB, 2 PIN
|
| Additional Feature |
|
EXCELLENT CLAMPING CAPABILITY
|
| Breakdown Voltage-Max |
|
25.2 V
|
| Breakdown Voltage-Min |
|
22.8 V
|
| Breakdown Voltage-Nom |
|
24 V
|
| Configuration |
|
SINGLE
|
| Diode Element Material |
|
SILICON
|
| Forward Voltage-Max (VF) |
|
3.5 V
|
| JEDEC-95 Code |
|
DO-214AA
|
| JESD-30 Code |
|
R-PDSO-C2
|
| Moisture Sensitivity Level |
|
1
|
| Non-rep Peak Rev Power Dis-Max |
|
600 W
|
| Number of Elements |
|
1
|
| Number of Terminals |
|
2
|
| Operating Temperature-Max |
|
175 °C
|
| Operating Temperature-Min |
|
-55 °C
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Shape |
|
RECTANGULAR
|
| Package Style |
|
SMALL OUTLINE
|
| Power Dissipation-Max |
|
5 W
|
| Reference Standard |
|
AEC-Q101; MIL-STD-750
|
| Reverse Current-Max |
|
1 µA
|
| Reverse Test Voltage |
|
20.5 V
|
| Technology |
|
AVALANCHE
|
| Terminal Form |
|
C BEND
|
| Terminal Position |
|
DUAL
|
|
|
|