23S08E-1HPGGI8
vs
IDT23S08E-1HPGG8
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Part Package Code |
TSSOP
|
TSSOP
|
| Pin Count |
16
|
16
|
| Manufacturer Package Code |
PGG16
|
|
| ECCN Code |
NLR
|
|
| HTS Code |
8542390000
|
8542.39.00.01
|
| Samacsys Manufacturer |
Renesas Electronics
|
|
| JESD-609 Code |
e3
|
e3
|
| Logic IC Type |
PLL BASED CLOCK DRIVER
|
PLL BASED CLOCK DRIVER
|
| Moisture Sensitivity Level |
1
|
1
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Terminal Finish |
TIN
|
Matte Tin (Sn) - annealed
|
| Base Number Matches |
2
|
1
|
| Rohs Code |
|
Yes
|
| Ihs Manufacturer |
|
INTEGRATED DEVICE TECHNOLOGY INC
|
| Package Description |
|
TSSOP-16
|
| Reach Compliance Code |
|
unknown
|
| Family |
|
23S
|
| Input Conditioning |
|
STANDARD
|
| JESD-30 Code |
|
R-PDSO-G16
|
| Length |
|
5 mm
|
| Max I(ol) |
|
0.012 A
|
| Number of Functions |
|
1
|
| Number of Inverted Outputs |
|
|
| Number of Terminals |
|
16
|
| Number of True Outputs |
|
8
|
| Operating Temperature-Max |
|
70 °C
|
| Operating Temperature-Min |
|
|
| Output Characteristics |
|
3-STATE
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Code |
|
TSSOP
|
| Package Equivalence Code |
|
TSSOP16,.25
|
| Package Shape |
|
RECTANGULAR
|
| Package Style |
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Qualification Status |
|
Not Qualified
|
| Same Edge Skew-Max (tskwd) |
|
0.2 ns
|
| Seated Height-Max |
|
1.2 mm
|
| Supply Voltage-Max (Vsup) |
|
3.6 V
|
| Supply Voltage-Min (Vsup) |
|
3 V
|
| Supply Voltage-Nom (Vsup) |
|
3.3 V
|
| Surface Mount |
|
YES
|
| Temperature Grade |
|
COMMERCIAL
|
| Terminal Form |
|
GULL WING
|
| Terminal Pitch |
|
0.65 mm
|
| Terminal Position |
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
| Width |
|
4.4 mm
|
| fmax-Min |
|
200 MHz
|
|
|
|
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