24LC64I/SM
vs
X25057SIT1
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
XICOR INC
|
| Part Package Code |
SOIC
|
|
| Package Description |
SOP,
|
PLASTIC, SOIC-8
|
| Pin Count |
8
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| Clock Frequency-Max (fCLK) |
0.4 MHz
|
5 MHz
|
| JESD-30 Code |
R-PDSO-G8
|
R-PDSO-G8
|
| JESD-609 Code |
e3
|
|
| Length |
5.245 mm
|
4.9 mm
|
| Memory Density |
65536 bit
|
4096 bit
|
| Memory IC Type |
EEPROM
|
EEPROM
|
| Memory Width |
8
|
8
|
| Moisture Sensitivity Level |
1
|
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
8
|
8
|
| Number of Words |
8192 words
|
512 words
|
| Number of Words Code |
8000
|
512
|
| Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Organization |
8KX8
|
512X8
|
| Output Characteristics |
OPEN-DRAIN
|
3-STATE
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
SOP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
| Parallel/Serial |
SERIAL
|
SERIAL
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
2.03 mm
|
1.75 mm
|
| Serial Bus Type |
I2C
|
SPI
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
2.5 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
MATTE TIN
|
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
|
| Width |
5.23 mm
|
3.9 mm
|
| Write Cycle Time-Max (tWC) |
5 ms
|
10 ms
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare 24LC64I/SM with alternatives
Compare X25057SIT1 with alternatives