24N50G-T3P-T
vs
SFF24N50B
feature comparison
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
UNISONIC TECHNOLOGIES CO LTD
|
SOLID STATE DEVICES INC
|
Package Description |
FLANGE MOUNT, R-PSFM-T3
|
CHIP CARRIER, R-CBCC-N3
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
Avalanche Energy Rating (Eas) |
1100 mJ
|
|
Configuration |
SINGLE WITH BUILT-IN DIODE
|
SINGLE WITH BUILT-IN DIODE
|
DS Breakdown Voltage-Min |
500 V
|
500 V
|
Drain Current-Max (ID) |
24 A
|
24 A
|
Drain-source On Resistance-Max |
0.24 Ω
|
0.25 Ω
|
FET Technology |
METAL-OXIDE SEMICONDUCTOR
|
METAL-OXIDE SEMICONDUCTOR
|
JESD-30 Code |
R-PSFM-T3
|
R-CBCC-N3
|
Number of Elements |
1
|
1
|
Number of Terminals |
3
|
3
|
Operating Mode |
ENHANCEMENT MODE
|
ENHANCEMENT MODE
|
Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, METAL-SEALED COFIRED
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
FLANGE MOUNT
|
CHIP CARRIER
|
Polarity/Channel Type |
N-CHANNEL
|
N-CHANNEL
|
Pulsed Drain Current-Max (IDM) |
96 A
|
|
Surface Mount |
NO
|
YES
|
Terminal Form |
THROUGH-HOLE
|
NO LEAD
|
Terminal Position |
SINGLE
|
BOTTOM
|
Transistor Application |
SWITCHING
|
SWITCHING
|
Transistor Element Material |
SILICON
|
SILICON
|
Base Number Matches |
1
|
1
|
Pin Count |
|
3
|
Qualification Status |
|
Not Qualified
|
|
|
|
Compare 24N50G-T3P-T with alternatives
Compare SFF24N50B with alternatives