2N6759
vs
IRF333
feature comparison
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Transferred
|
Active
|
Ihs Manufacturer |
INTERSIL CORP
|
ROCHESTER ELECTRONICS LLC
|
Reach Compliance Code |
not_compliant
|
unknown
|
ECCN Code |
EAR99
|
|
Configuration |
SINGLE
|
SINGLE
|
Drain Current-Max (ID) |
4.5 A
|
4.5 A
|
FET Technology |
METAL-OXIDE SEMICONDUCTOR
|
METAL-OXIDE SEMICONDUCTOR
|
JESD-609 Code |
e0
|
e0
|
Number of Elements |
1
|
1
|
Operating Mode |
ENHANCEMENT MODE
|
ENHANCEMENT MODE
|
Operating Temperature-Max |
150 °C
|
|
Polarity/Channel Type |
N-CHANNEL
|
N-CHANNEL
|
Power Dissipation-Max (Abs) |
75 W
|
|
Surface Mount |
NO
|
NO
|
Terminal Finish |
Tin/Lead (Sn/Pb)
|
TIN LEAD
|
Base Number Matches |
1
|
1
|
Pbfree Code |
|
No
|
Case Connection |
|
DRAIN
|
DS Breakdown Voltage-Min |
|
350 V
|
Drain-source On Resistance-Max |
|
1.5 Ω
|
JEDEC-95 Code |
|
TO-204AA
|
JESD-30 Code |
|
O-MBFM-P2
|
Number of Terminals |
|
2
|
Package Body Material |
|
METAL
|
Package Shape |
|
ROUND
|
Package Style |
|
FLANGE MOUNT
|
Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
Pulsed Drain Current-Max (IDM) |
|
16 A
|
Qualification Status |
|
COMMERCIAL
|
Terminal Form |
|
PIN/PEG
|
Terminal Position |
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
Transistor Element Material |
|
SILICON
|
|
|
|
Compare 2N6759 with alternatives
Compare IRF333 with alternatives