2SC5761-T2FB vs BFG94,115 feature comparison

2SC5761-T2FB NEC Compound Semiconductor Devices Ltd

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BFG94,115 NXP Semiconductors

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Rohs Code No Yes
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer NEC COMPOUND SEMICONDUCTOR DEVICES LTD NXP SEMICONDUCTORS
Package Description M04, THIN, SUPERMINI MINIMOLD PACKAGE-4 PLASTIC, SC-73, 4 PIN
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
Case Connection COLLECTOR COLLECTOR
Collector Current-Max (IC) 0.035 A 0.06 A
Collector-Base Capacitance-Max 0.22 pF 2 pF
Collector-Emitter Voltage-Max 2.3 V 12 V
Configuration SINGLE SINGLE
Highest Frequency Band L BAND ULTRA HIGH FREQUENCY BAND
JESD-30 Code R-PDSO-F4 R-PDSO-G4
JESD-609 Code e0 e3
Number of Elements 1 1
Number of Terminals 4 4
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Polarity/Channel Type NPN NPN
Qualification Status Not Qualified Not Qualified
Surface Mount YES YES
Terminal Finish TIN LEAD MATTE TIN
Terminal Form FLAT GULL WING
Terminal Position DUAL DUAL
Transistor Application AMPLIFIER AMPLIFIER
Transistor Element Material SILICON GERMANIUM SILICON
Transition Frequency-Nom (fT) 60000 MHz 6000 MHz
Base Number Matches 2 1
Part Package Code SC-73
Pin Count 4
Manufacturer Package Code SOT223
HTS Code 8541.21.00.75
Additional Feature HIGH RELIABILITY
DC Current Gain-Min (hFE) 45
Operating Temperature-Max 175 °C
Power Dissipation Ambient-Max 0.7 W
Power Dissipation-Max (Abs) 0.7 W
Reference Standard CECC

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