2SK1928
vs
STD70N10F4
feature comparison
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
TOSHIBA CORP
|
STMICROELECTRONICS
|
| Part Package Code |
TO-220FL
|
TO-252
|
| Package Description |
IN-LINE, R-PSIP-T3
|
ROHS COMPLIANT, DPAK-3
|
| Pin Count |
3
|
3
|
| Reach Compliance Code |
unknown
|
not_compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8541.29.00.95
|
|
| Case Connection |
DRAIN
|
|
| Configuration |
SINGLE
|
SINGLE WITH BUILT-IN DIODE
|
| DS Breakdown Voltage-Min |
100 V
|
100 V
|
| Drain Current-Max (ID) |
27 A
|
60 A
|
| Drain-source On Resistance-Max |
0.085 Ω
|
0.0195 Ω
|
| FET Technology |
METAL-OXIDE SEMICONDUCTOR
|
METAL-OXIDE SEMICONDUCTOR
|
| JESD-30 Code |
R-PSIP-T3
|
R-PSSO-G2
|
| JESD-609 Code |
e0
|
e3
|
| Number of Elements |
1
|
1
|
| Number of Terminals |
3
|
2
|
| Operating Mode |
ENHANCEMENT MODE
|
ENHANCEMENT MODE
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
SMALL OUTLINE
|
| Polarity/Channel Type |
N-CHANNEL
|
N-CHANNEL
|
| Power Dissipation Ambient-Max |
100 W
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Surface Mount |
NO
|
YES
|
| Terminal Finish |
TIN LEAD
|
Matte Tin (Sn) - annealed
|
| Terminal Form |
THROUGH-HOLE
|
GULL WING
|
| Terminal Position |
SINGLE
|
SINGLE
|
| Transistor Application |
SWITCHING
|
SWITCHING
|
| Transistor Element Material |
SILICON
|
SILICON
|
| Base Number Matches |
1
|
1
|
| Factory Lead Time |
|
32 Weeks, 4 Days
|
| Samacsys Manufacturer |
|
STMicroelectronics
|
| Avalanche Energy Rating (Eas) |
|
120 mJ
|
| JEDEC-95 Code |
|
TO-252
|
| Moisture Sensitivity Level |
|
1
|
| Operating Temperature-Max |
|
175 °C
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Power Dissipation-Max (Abs) |
|
125 W
|
| Pulsed Drain Current-Max (IDM) |
|
240 A
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare 2SK1928 with alternatives
Compare STD70N10F4 with alternatives