548G-05
vs
5P35021-000NDGI8
feature comparison
| Pbfree Code |
No
|
Yes
|
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
INTEGRATED DEVICE TECHNOLOGY INC
|
INTEGRATED DEVICE TECHNOLOGY INC
|
| Part Package Code |
TSSOP
|
VFQFPN
|
| Package Description |
MO-153, TSSOP-16
|
VFQFPN-20
|
| Pin Count |
16
|
20
|
| Manufacturer Package Code |
PG16
|
NDG20P2
|
| Reach Compliance Code |
not_compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| JESD-30 Code |
R-PDSO-G16
|
S-XQCC-N20
|
| JESD-609 Code |
e0
|
e3
|
| Length |
5 mm
|
3 mm
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Terminals |
16
|
20
|
| Operating Temperature-Max |
70 °C
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Output Clock Frequency-Max |
49.152 MHz
|
500 MHz
|
| Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
| Package Code |
TSSOP
|
HVQCCN
|
| Package Equivalence Code |
TSSOP16,.25
|
LCC20,.11SQ,16
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
240
|
260
|
| Primary Clock/Crystal Frequency-Nom |
2.048 MHz
|
125 MHz
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
1.2 mm
|
1 mm
|
| Supply Voltage-Max |
5.5 V
|
3.465 V
|
| Supply Voltage-Min |
3.15 V
|
3.135 V
|
| Supply Voltage-Nom |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
| Terminal Finish |
TIN LEAD
|
TIN
|
| Terminal Form |
GULL WING
|
NO LEAD
|
| Terminal Pitch |
0.65 mm
|
0.4 mm
|
| Terminal Position |
DUAL
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
20
|
|
| Width |
4.4 mm
|
3 mm
|
| uPs/uCs/Peripheral ICs Type |
CLOCK GENERATOR, OTHER
|
CLOCK GENERATOR, OTHER
|
| Base Number Matches |
2
|
2
|
| Date Of Intro |
|
2016-05-26
|
|
|
|
Compare 548G-05 with alternatives
Compare 5P35021-000NDGI8 with alternatives