54AC74LMQB
vs
TC74AC74F
feature comparison
Rohs Code |
No
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
NATIONAL SEMICONDUCTOR CORP
|
TOSHIBA CORP
|
Package Description |
QCCN, LCC20,.35SQ
|
SOP, SOP14,.3
|
Reach Compliance Code |
unknown
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Family |
AC
|
AC
|
JESD-30 Code |
S-CQCC-N20
|
R-PDSO-G14
|
JESD-609 Code |
e0
|
|
Length |
8.89 mm
|
10.3 mm
|
Load Capacitance (CL) |
50 pF
|
50 pF
|
Logic IC Type |
D FLIP-FLOP
|
D FLIP-FLOP
|
Max Frequency@Nom-Sup |
70000000 Hz
|
60000000 Hz
|
Max I(ol) |
0.012 A
|
0.012 A
|
Number of Bits |
1
|
1
|
Number of Functions |
2
|
2
|
Number of Terminals |
20
|
14
|
Operating Temperature-Max |
125 °C
|
85 °C
|
Operating Temperature-Min |
-55 °C
|
-40 °C
|
Output Polarity |
COMPLEMENTARY
|
COMPLEMENTARY
|
Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
PLASTIC/EPOXY
|
Package Code |
QCCN
|
SOP
|
Package Equivalence Code |
LCC20,.35SQ
|
SOP14,.3
|
Package Shape |
SQUARE
|
RECTANGULAR
|
Package Style |
CHIP CARRIER
|
SMALL OUTLINE
|
Packing Method |
RAIL
|
|
Propagation Delay (tpd) |
17.5 ns
|
16 ns
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Screening Level |
MIL-STD-883 Class B
|
|
Seated Height-Max |
1.905 mm
|
1.9 mm
|
Supply Voltage-Max (Vsup) |
6 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
2 V
|
2 V
|
Supply Voltage-Nom (Vsup) |
3.3 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
MILITARY
|
INDUSTRIAL
|
Terminal Finish |
TIN LEAD
|
|
Terminal Form |
NO LEAD
|
GULL WING
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
QUAD
|
DUAL
|
Trigger Type |
POSITIVE EDGE
|
POSITIVE EDGE
|
Width |
8.89 mm
|
5.3 mm
|
fmax-Min |
95 MHz
|
100 MHz
|
Base Number Matches |
2
|
11
|
Part Package Code |
|
SOIC
|
Pin Count |
|
14
|
Samacsys Manufacturer |
|
Toshiba
|
Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
Compare 54AC74LMQB with alternatives
Compare TC74AC74F with alternatives