54F181FM-MLS
vs
5962H9653601QEC
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
NATIONAL SEMICONDUCTOR CORP
|
AEROFLEX COLORADO SPRINGS
|
| Part Package Code |
DFP
|
DIP
|
| Package Description |
DFP, FL24,.4
|
DIP,
|
| Pin Count |
24
|
16
|
| Reach Compliance Code |
compliant
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Family |
F/FAST
|
AC
|
| JESD-30 Code |
R-GDFP-F24
|
R-CDIP-T16
|
| JESD-609 Code |
e0
|
e4
|
| Length |
15.113 mm
|
19.05 mm
|
| Logic IC Type |
ARITHMETIC LOGIC UNIT
|
MAGNITUDE COMPARATOR
|
| Moisture Sensitivity Level |
1
|
|
| Number of Bits |
4
|
4
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
24
|
16
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Package Body Material |
CERAMIC, GLASS-SEALED
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
DFP
|
DIP
|
| Package Equivalence Code |
FL24,.4
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
FLATPACK
|
IN-LINE
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Propagation Delay (tpd) |
17 ns
|
22 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Screening Level |
38535Q/M;38534H;883B
|
MIL-PRF-38535 Class Q
|
| Seated Height-Max |
2.54 mm
|
5.08 mm
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
NO
|
| Technology |
TTL
|
CMOS
|
| Temperature Grade |
MILITARY
|
MILITARY
|
| Terminal Finish |
TIN LEAD
|
GOLD
|
| Terminal Form |
FLAT
|
THROUGH-HOLE
|
| Terminal Pitch |
1.27 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
|
| Base Number Matches |
1
|
1
|
| Additional Feature |
|
CASCADABLE
|
| Output Polarity |
|
TRUE
|
| Total Dose |
|
1M Rad(Si) V
|
| Width |
|
7.62 mm
|
|
|
|
Compare 54F181FM-MLS with alternatives
Compare 5962H9653601QEC with alternatives