54F323DMQB
vs
100341FMQB
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
NATIONAL SEMICONDUCTOR CORP
|
TELEDYNE E2V (UK) LTD
|
| Package Description |
DIP, DIP20,.3
|
|
| Reach Compliance Code |
unknown
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Additional Feature |
HOLD MODE; COMMON I/O PINS
|
|
| Count Direction |
BIDIRECTIONAL
|
BIDIRECTIONAL
|
| Family |
F/FAST
|
100K
|
| JESD-30 Code |
R-GDIP-T20
|
S-GQFP-F24
|
| JESD-609 Code |
e0
|
|
| Length |
24.51 mm
|
9.398 mm
|
| Logic IC Type |
PARALLEL IN PARALLEL OUT
|
PARALLEL IN PARALLEL OUT
|
| Number of Bits |
8
|
8
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
20
|
24
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Output Characteristics |
3-STATE
|
|
| Output Polarity |
TRUE
|
TRUE
|
| Package Body Material |
CERAMIC, GLASS-SEALED
|
CERAMIC, GLASS-SEALED
|
| Package Code |
DIP
|
QFP
|
| Package Equivalence Code |
DIP20,.3
|
QFL24,.37SQ
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
IN-LINE
|
FLAT PACK
|
| Qualification Status |
Not Qualified
|
|
| Screening Level |
38535Q/M;38534H;883B
|
MIL-STD-883B
|
| Seated Height-Max |
5.08 mm
|
2.159 mm
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
|
| Supply Voltage-Nom (Vsup) |
5 V
|
|
| Surface Mount |
NO
|
YES
|
| Technology |
TTL
|
ECL
|
| Temperature Grade |
MILITARY
|
MILITARY
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
THROUGH-HOLE
|
FLAT
|
| Terminal Pitch |
2.54 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
QUAD
|
| Trigger Type |
POSITIVE EDGE
|
POSITIVE EDGE
|
| Width |
7.62 mm
|
9.398 mm
|
| fmax-Min |
100 MHz
|
400 MHz
|
| Base Number Matches |
1
|
1
|
| Propagation Delay (tpd) |
|
2.3 ns
|
|
|
|
Compare 54F323DMQB with alternatives