54F38/BCA vs 5962-8687201CX feature comparison

54F38/BCA NXP Semiconductors

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5962-8687201CX Motorola Mobility LLC

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS MOTOROLA INC
Package Description DIP, DIP,
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family F/FAST F/FAST
JESD-30 Code R-GDIP-T14 R-XDIP-T14
Load Capacitance (CL) 50 pF
Logic IC Type NAND GATE NAND GATE
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Output Characteristics OPEN-COLLECTOR OPEN-COLLECTOR
Package Body Material CERAMIC, GLASS-SEALED UNSPECIFIED
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Power Supply Current-Max (ICC) 30 mA
Propagation Delay (tpd) 6 ns 15 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.08 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology TTL TTL
Temperature Grade MILITARY MILITARY
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm
Base Number Matches 3 6
Part Package Code DIP
Pin Count 14
JESD-609 Code e0
Screening Level MIL-STD-883
Terminal Finish TIN LEAD

Compare 54F38/BCA with alternatives

Compare 5962-8687201CX with alternatives