54F38DMQB
vs
MC74F38JD
feature comparison
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
TELEDYNE E2V (UK) LTD
|
MOTOROLA INC
|
| Package Description |
DIP,
|
DIP,
|
| Reach Compliance Code |
compliant
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Additional Feature |
LG-MAX
|
|
| Family |
F/FAST
|
F/FAST
|
| JESD-30 Code |
R-GDIP-T14
|
R-GDIP-T14
|
| Length |
19.939 mm
|
19.495 mm
|
| Logic IC Type |
NAND GATE
|
NAND GATE
|
| Number of Functions |
4
|
4
|
| Number of Inputs |
2
|
2
|
| Number of Terminals |
14
|
14
|
| Operating Temperature-Max |
125 °C
|
70 °C
|
| Operating Temperature-Min |
-55 °C
|
|
| Output Characteristics |
OPEN-COLLECTOR
|
OPEN-COLLECTOR
|
| Package Body Material |
CERAMIC, GLASS-SEALED
|
CERAMIC, GLASS-SEALED
|
| Package Code |
DIP
|
DIP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Propagation Delay (tpd) |
14.5 ns
|
5.5 ns
|
| Seated Height-Max |
5.08 mm
|
5.08 mm
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
TTL
|
TTL
|
| Temperature Grade |
MILITARY
|
COMMERCIAL
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
7.62 mm
|
7.62 mm
|
| Base Number Matches |
3
|
2
|
| Load Capacitance (CL) |
|
50 pF
|
| Power Supply Current-Max (ICC) |
|
30 mA
|
| Qualification Status |
|
Not Qualified
|
|
|
|
Compare 54F38DMQB with alternatives
Compare MC74F38JD with alternatives