54F533FMQB
vs
MC54F533J
feature comparison
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
TELEDYNE E2V (UK) LTD
|
MOTOROLA INC
|
| Package Description |
FP-20
|
DIP, DIP20,.3
|
| Reach Compliance Code |
compliant
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Control Type |
ENABLE LOW
|
|
| Count Direction |
UNIDIRECTIONAL
|
|
| Family |
F/FAST
|
F/FAST
|
| JESD-30 Code |
R-GDFP-F20
|
R-CDIP-T20
|
| Length |
13.716 mm
|
24.515 mm
|
| Load Capacitance (CL) |
50 pF
|
50 pF
|
| Logic IC Type |
BUS DRIVER
|
BUS DRIVER
|
| Max I(ol) |
0.02 A
|
0.024 A
|
| Number of Bits |
8
|
8
|
| Number of Functions |
1
|
1
|
| Number of Ports |
2
|
2
|
| Number of Terminals |
20
|
20
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Output Polarity |
INVERTED
|
INVERTED
|
| Package Body Material |
CERAMIC, GLASS-SEALED
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
DFP
|
DIP
|
| Package Equivalence Code |
FL20,.3
|
DIP20,.3
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
FLATPACK
|
IN-LINE
|
| Power Supply Current-Max (ICC) |
61 mA
|
61 mA
|
| Prop. Delay@Nom-Sup |
14 ns
|
14 ns
|
| Propagation Delay (tpd) |
14 ns
|
9 ns
|
| Screening Level |
MIL-STD-883 Class B
|
|
| Seated Height-Max |
2.286 mm
|
5.08 mm
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
NO
|
| Technology |
TTL
|
TTL
|
| Terminal Form |
FLAT
|
THROUGH-HOLE
|
| Terminal Pitch |
1.27 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
6.731 mm
|
7.62 mm
|
| Base Number Matches |
5
|
4
|
| Rohs Code |
|
No
|
| Part Package Code |
|
DIP
|
| Pin Count |
|
20
|
| JESD-609 Code |
|
e0
|
| Qualification Status |
|
Not Qualified
|
| Temperature Grade |
|
MILITARY
|
| Terminal Finish |
|
TIN LEAD
|
|
|
|
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