5962-01-231-5679
vs
5962-01-226-5601
feature comparison
Pbfree Code |
No
|
|
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Transferred
|
Contact Manufacturer
|
Ihs Manufacturer |
INTERSIL CORP
|
RENESAS ELECTRONICS CORP
|
Package Description |
DIP, DIP16,.3
|
,
|
Reach Compliance Code |
not_compliant
|
not_compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
JESD-30 Code |
R-XDIP-T16
|
|
Load Capacitance (CL) |
50 pF
|
|
Logic IC Type |
BUFFER
|
|
Max I(ol) |
0.0018 A
|
|
Number of Terminals |
16
|
|
Operating Temperature-Max |
125 °C
|
|
Operating Temperature-Min |
-55 °C
|
|
Package Body Material |
CERAMIC
|
|
Package Code |
DIP
|
|
Package Equivalence Code |
DIP16,.3
|
|
Package Shape |
RECTANGULAR
|
|
Package Style |
IN-LINE
|
|
Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
NOT SPECIFIED
|
Prop. Delay@Nom-Sup |
140 ns
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Schmitt Trigger |
NO
|
|
Screening Level |
38535Q/M;38534H;883B
|
|
Surface Mount |
NO
|
|
Technology |
CMOS
|
|
Temperature Grade |
MILITARY
|
|
Terminal Form |
THROUGH-HOLE
|
|
Terminal Pitch |
2.54 mm
|
|
Terminal Position |
DUAL
|
|
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
NOT SPECIFIED
|
Base Number Matches |
2
|
2
|
|
|
|
Compare 5962-01-231-5679 with alternatives
Compare 5962-01-226-5601 with alternatives