5962-0254501VPA
vs
LMH6624MA
feature comparison
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
NATIONAL SEMICONDUCTOR CORP
|
NATIONAL SEMICONDUCTOR CORP
|
| Part Package Code |
DIP
|
SOIC
|
| Package Description |
DIP, DIP8,.3
|
SOIC-8
|
| Pin Count |
8
|
8
|
| Reach Compliance Code |
unknown
|
not_compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.33.00.01
|
8542.33.00.01
|
| Amplifier Type |
OPERATIONAL AMPLIFIER
|
OPERATIONAL AMPLIFIER
|
| Architecture |
VOLTAGE-FEEDBACK
|
VOLTAGE-FEEDBACK
|
| Average Bias Current-Max (IIB) |
10 µA
|
20 µA
|
| Bias Current-Max (IIB) @25C |
20 µA
|
20 µA
|
| Frequency Compensation |
YES
|
YES
|
| Input Offset Voltage-Max |
2000 µV
|
750 µV
|
| JESD-30 Code |
R-CDIP-T8
|
R-PDSO-G8
|
| JESD-609 Code |
e0
|
e0
|
| Low-Bias |
NO
|
|
| Low-Offset |
NO
|
YES
|
| Micropower |
NO
|
|
| Neg Supply Voltage Limit-Max |
-7 V
|
-6.6 V
|
| Neg Supply Voltage-Nom (Vsup) |
-5 V
|
-2.5 V
|
| Number of Functions |
2
|
1
|
| Number of Terminals |
8
|
8
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-40 °C
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
SOP
|
| Package Equivalence Code |
DIP8,.3
|
SOP8,.25
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
SMALL OUTLINE
|
| Power |
NO
|
|
| Programmable Power |
NO
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Screening Level |
MIL-PRF-38535 Class V
|
|
| Supply Current-Max |
25 mA
|
18 mA
|
| Supply Voltage Limit-Max |
7 V
|
6.6 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
2.5 V
|
| Surface Mount |
NO
|
YES
|
| Technology |
BIPOLAR
|
BIPOLAR
|
| Temperature Grade |
MILITARY
|
AUTOMOTIVE
|
| Terminal Finish |
TIN LEAD
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
THROUGH-HOLE
|
GULL WING
|
| Terminal Pitch |
2.54 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Voltage Gain-Min |
560
|
3160
|
| Wideband |
YES
|
YES
|
| Base Number Matches |
2
|
2
|
| Rohs Code |
|
No
|
| Common-mode Reject Ratio-Nom |
|
90 dB
|
| Length |
|
4.902 mm
|
| Moisture Sensitivity Level |
|
1
|
| Packing Method |
|
RAIL
|
| Peak Reflow Temperature (Cel) |
|
235
|
| Seated Height-Max |
|
1.753 mm
|
| Slew Rate-Nom |
|
300 V/us
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
| Width |
|
3.899 mm
|
|
|
|
Compare 5962-0254501VPA with alternatives
Compare LMH6624MA with alternatives